Jeffery J. Gilbert

Person

Schwenksville, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical devices having adjustable capacitance
- Patent number 7,960,812
- Issue date Jun 14, 2011
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for encapsulated semiconductor devices and method of makin...
- Patent number 7,956,451
- Issue date Jun 7, 2011
- Agere Systems Inc.
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having flexible leadframe
- Patent number 7,541,220
- Issue date Jun 2, 2009
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with base features to reduce leakage
- Patent number 7,541,669
- Issue date Jun 2, 2009
- Agere Systems Inc.
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices having adjustable electrical characteristics
- Patent number 7,456,716
- Issue date Nov 25, 2008
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with reduced leakage
- Patent number 7,224,047
- Issue date May 29, 2007
- LSI Corporation
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having flexible leadframe
- Patent number 7,030,472
- Issue date Apr 18, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL DEVICES HAVING ADJUSTABLE CAPACITANCE
- Publication number 20090040683
- Publication date Feb 12, 2009
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with base features to reduce leakage
- Publication number 20070241433
- Publication date Oct 18, 2007
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe designs for plastic cavity transistor packages
- Publication number 20060145317
- Publication date Jul 6, 2006
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for encapsulated semiconductor devices and method of makin...
- Publication number 20060131704
- Publication date Jun 22, 2006
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with reduced leakage
- Publication number 20060131707
- Publication date Jun 22, 2006
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device having flexible leadframe
- Publication number 20060097367
- Publication date May 11, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulating compound having reduced dielectric constant
- Publication number 20050287350
- Publication date Dec 29, 2005
- David L. Crouthamel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device having flexible leadframe
- Publication number 20050224926
- Publication date Oct 13, 2005
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array (BGA) package having corner or edge tab supports
- Publication number 20050077080
- Publication date Apr 14, 2005
- Adesoji Dairo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Jeffery J. Gilbert

Person

Patents Grantslast 30 patents

Electrical devices having adjustable capacitance

Packages for encapsulated semiconductor devices and method of makin...

Integrated circuit device having flexible leadframe

Semiconductor device package with base features to reduce leakage

Electrical devices having adjustable electrical characteristics

Semiconductor device package with reduced leakage

Integrated circuit device having flexible leadframe

Patents Applicationslast 30 patents

ELECTRICAL DEVICES HAVING ADJUSTABLE CAPACITANCE

Semiconductor device package with base features to reduce leakage

Leadframe designs for plastic cavity transistor packages

Packages for encapsulated semiconductor devices and method of makin...

Semiconductor device package with reduced leakage

Integrated circuit device having flexible leadframe

Encapsulating compound having reduced dielectric constant

Integrated circuit device having flexible leadframe

Ball grid array (BGA) package having corner or edge tab supports