Jeffery N. Gleason

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Meridian, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Intermediate semiconductor device structure
- Patent number 7,687,879
- Issue date Mar 30, 2010
- Micron Technology, Inc.
- Jeffery N. Gleason
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nickel bonding cap over copper metalized bondpads
- Patent number 7,485,565
- Issue date Feb 3, 2009
- Micron Technologies, Inc.
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nickel bonding cap over copper metalized bondpads
- Patent number 7,186,636
- Issue date Mar 6, 2007
- Micron Technology, Inc.
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nickel bonding cap over copper metalized bondpads
- Patent number 7,067,924
- Issue date Jun 27, 2006
- Micron Technology, Inc.
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nickel bonding cap over copper metalized bondpads
- Patent number 6,825,564
- Issue date Nov 30, 2004
- Micron Technology, Inc.
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Nickel bonding cap over copper metalized bondpads
- Publication number 20060276016
- Publication date Dec 7, 2006
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nickel bonding cap over copper metalized bondpads
- Publication number 20050023685
- Publication date Feb 3, 2005
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nickel bonding cap over copper metalized bondpads
- Publication number 20050020069
- Publication date Jan 27, 2005
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Using stabilizers in electroless solutions to inhibit plating of fuses
- Publication number 20040157440
- Publication date Aug 12, 2004
- Jeffery N. Gleason
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Nickel bonding cap over copper metalized bondpads
- Publication number 20040036137
- Publication date Feb 26, 2004
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
USING STABILIZERS IN ELECTROLESS SOLUTIONS TO INHIBIT PLATING OF FUSES
- Publication number 20030219976
- Publication date Nov 27, 2003
- Jeffery N. Gleason
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...