Jeffrey Chen

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip type LED lighting device manufacturing method
- Patent number 8,120,052
- Issue date Feb 21, 2012
- Neobulb Technologies, Inc.
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip type LED lighting device manufacturing method
- Patent number 7,795,626
- Issue date Sep 14, 2010
- Neobulb Technologies, Inc.
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip type LED lighting device manufacturing method
- Patent number 7,652,298
- Issue date Jan 26, 2010
- Neobulb Technologies, Inc.
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip type LED lighting device manufacturing method
- Patent number 7,646,030
- Issue date Jan 12, 2010
- Neobulb Technologies, Inc.
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip type LED lighting device manufacturing method
- Patent number 7,629,188
- Issue date Dec 8, 2009
- Neobulb Technologies, Inc.
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light set with heat dissipation means
- Patent number 7,438,448
- Issue date Oct 21, 2008
- Neobulb Technologies, Inc.
- Jeffrey Chen
- F21 - LIGHTING
Information Patent Grant
Light source assembly having high-performance heat dissipation means
- Patent number 7,098,486
- Issue date Aug 29, 2006
- Neobulb Technologies, Inc.
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP TYPE LED LIGHTING DEVICE MANUFACTURING METHOD
- Publication number 20100133558
- Publication date Jun 3, 2010
- NEOBULB TECHNOLOGIES, INC.
- JEFFREY CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light set with heat dissipation means
- Publication number 20080265273
- Publication date Oct 30, 2008
- Jeffrey Chen
- F21 - LIGHTING
Information Patent Application
Flip chip type LED lighting device manufacturing method
- Publication number 20080142818
- Publication date Jun 19, 2008
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip type LED lighting device manufacturing method
- Publication number 20080001164
- Publication date Jan 3, 2008
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip type LED lighting device manufacturing method
- Publication number 20070257344
- Publication date Nov 8, 2007
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light set with heat dissipation means
- Publication number 20060098439
- Publication date May 11, 2006
- Jeffrey Chen
- F21 - LIGHTING
Information Patent Application
Flip chip type LED lighting device manufacturing method
- Publication number 20060097276
- Publication date May 11, 2006
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light source assembly having high-performance heat dissipation means
- Publication number 20060054911
- Publication date Mar 16, 2006
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated device with heat isolating structure
- Publication number 20050285257
- Publication date Dec 29, 2005
- Jeffrey Chen
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey Chen

Person

Patents Grantslast 30 patents

Flip chip type LED lighting device manufacturing method

Flip chip type LED lighting device manufacturing method

Flip chip type LED lighting device manufacturing method

Flip chip type LED lighting device manufacturing method

Flip chip type LED lighting device manufacturing method

Light set with heat dissipation means

Light source assembly having high-performance heat dissipation means

Patents Applicationslast 30 patents

FLIP CHIP TYPE LED LIGHTING DEVICE MANUFACTURING METHOD

Light set with heat dissipation means

Flip chip type LED lighting device manufacturing method

Flip chip type LED lighting device manufacturing method

Flip chip type LED lighting device manufacturing method

Light set with heat dissipation means

Flip chip type LED lighting device manufacturing method

Light source assembly having high-performance heat dissipation means

Encapsulated device with heat isolating structure