Jeffrey D. Gelorme

Person

Burlington, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic temporary adhesive for silicon handler with infra-red...
- Patent number 11,574,835
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Bing Dang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,424,152
- Issue date Aug 23, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 11,348,833
- Issue date May 31, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming wearable stacked strain gauge sensor for monitoring
- Patent number 11,172,837
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Katsuyuki Sakuma
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,121,005
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics miniaturization platform for medication verification an...
- Patent number 11,094,407
- Issue date Aug 17, 2021
- International Business Machines Corporation
- John Knickerbocker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Thermoplastic temporary adhesive for silicon handler with infra-red...
- Patent number 10,998,217
- Issue date May 4, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,679,887
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip handling and electronic component integration
- Patent number 10,658,182
- Issue date May 19, 2020
- International Business Machines Corporation
- Russell A. Budd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,651,134
- Issue date May 12, 2020
- International Business Machines Corporation
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip handling and electronic component integration
- Patent number 10,651,036
- Issue date May 12, 2020
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Grant
Chip package for two-phase cooling and assembly process thereof
- Patent number 10,607,963
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,586,726
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,573,538
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic temporary adhesive for silicon handler with infra-red...
- Patent number 10,522,383
- Issue date Dec 31, 2019
- International Business Machines Corporation
- Bing Dang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 10,522,406
- Issue date Dec 31, 2019
- International Busniess Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,483,215
- Issue date Nov 19, 2019
- International Business Machines Corporation
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip handling and electronic component integration
- Patent number 10,395,929
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,325,785
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,224,219
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip handling and electronic component integration
- Patent number 10,217,637
- Issue date Feb 26, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive resins for wafer bonding
- Patent number 10,174,229
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Robert D. Allen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Water soluble low alpha particle emission electrically-conductive c...
- Patent number 10,168,436
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dual seal microbattery and method of making
- Patent number 10,079,375
- Issue date Sep 18, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic temporary adhesive for silicon handler with infra-red...
- Patent number 9,947,567
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 9,947,570
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS W...
- Publication number 20240213115
- Publication date Jun 27, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROPHOBIC MEDIA FOR THE COLLECTION OF MINERAL PARTICLES IN AQUEOU...
- Publication number 20230053562
- Publication date Feb 23, 2023
- CiDRA CORPORATE SERVICES LLC
- Michael Stephen RYAN
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Electronics Miniaturization Platform for Medication Verification an...
- Publication number 20200395115
- Publication date Dec 17, 2020
- International Business Machines Corporation
- John Knickerbocker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20200176297
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20200168475
- Publication date May 28, 2020
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wearable Stacked Strain Gauge Sensor for Monitoring
- Publication number 20200121204
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Katsuyuki Sakuma
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20200098638
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...
- Publication number 20200083082
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION
- Publication number 20190378720
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Application
CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION
- Publication number 20190378719
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20190198457
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Jeffrey GELORME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE ADHESIVE BOND MATERIAL
- Publication number 20190194506
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Jeffrey D. Gelorme
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20190189469
- Publication date Jun 20, 2019
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION
- Publication number 20190088481
- Publication date Mar 21, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Application
CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION
- Publication number 20190088480
- Publication date Mar 21, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180218934
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20180182672
- Publication date Jun 28, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...
- Publication number 20180174882
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Bing Dang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180138072
- Publication date May 17, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180138073
- Publication date May 17, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20180082959
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Jeffrey GELORME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF
- Publication number 20180076113
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE RESINS FOR WAFER BONDING
- Publication number 20180072926
- Publication date Mar 15, 2018
- International Business Machines Corporation
- ROBERT D. ALLEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Water Soluble Low Alpha Particle Emission Electrically-Conductive C...
- Publication number 20170329020
- Publication date Nov 16, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20170287782
- Publication date Oct 5, 2017
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS UNDERFILL ENABLING REWORK
- Publication number 20170200659
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Michael Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20170194185
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey D. Gelorme

Person

Patents Grantslast 30 patents

Thermal interface material, an integrated circuit formed therewith,...

Thermoplastic temporary adhesive for silicon handler with infra-red...

Handler bonding and debonding for semiconductor dies

IR assisted fan-out wafer level packaging using silicon handler

Forming wearable stacked strain gauge sensor for monitoring

Handler bonding and debonding for semiconductor dies

Electronics miniaturization platform for medication verification an...

Thermoplastic temporary adhesive for silicon handler with infra-red...

Method and apparatus for strain relieving surface mount attached co...

Handler bonding and debonding for semiconductor dies

Chip handling and electronic component integration

Wafer level integration including design/co-design, structure proce...

Chip handling and electronic component integration

Chip package for two-phase cooling and assembly process thereof

Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

Thermoplastic temporary adhesive for silicon handler with infra-red...

IR assisted fan-out wafer level packaging using silicon handler

Wafer level integration including design/co-design, structure proce...

Chip handling and electronic component integration

Method and apparatus for strain relieving surface mount attached co...

Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

Chip handling and electronic component integration

Adhesive resins for wafer bonding

Water soluble low alpha particle emission electrically-conductive c...

Dual seal microbattery and method of making

Method and apparatus for strain relieving surface mount attached co...

Thermoplastic temporary adhesive for silicon handler with infra-red...

Handler bonding and debonding for semiconductor dies

Patents Applicationslast 30 patents

A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS W...

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

HYDROPHOBIC MEDIA FOR THE COLLECTION OF MINERAL PARTICLES IN AQUEOU...

Electronics Miniaturization Platform for Medication Verification an...

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

Wearable Stacked Strain Gauge Sensor for Monitoring

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...

CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION

CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

LOW TEMPERATURE ADHESIVE BOND MATERIAL

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION

CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF

ADHESIVE RESINS FOR WAFER BONDING

Water Soluble Low Alpha Particle Emission Electrically-Conductive C...

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

POROUS UNDERFILL ENABLING REWORK

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES