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Jeffrey D. Hanna
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Spicewood, TX, US
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Patents Grants
last 30 patents
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Patent Grant
Bonded wafer structure having cavities with low pressure and method...
Patent number
9,637,372
Issue date
May 2, 2017
NXP USA, INC.
Robert F. Steimle
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Methods for bonding semiconductor wafers
Patent number
9,418,830
Issue date
Aug 16, 2016
FREESCALE SEMICONDUCTOR, INC.
Jeffrey D. Hanna
B81 - MICRO-STRUCTURAL TECHNOLOGY
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last 30 patents
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Patent Application
BONDED WAFER STRUCTURE HAVING CAVITIES WITH LOW PRESSURE AND METHOD...
Publication number
20160311676
Publication date
Oct 27, 2016
FREESCALE SEMICONDUCTOR, INC.
Robert F. STEIMLE
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHODS FOR BONDING SEMICONDUCTOR WAFERS
Publication number
20150380235
Publication date
Dec 31, 2015
JEFFREY D. HANNA
H01 - BASIC ELECTRIC ELEMENTS