Jeffrey David Birdsley

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die analysis as a function of optical reflections fro...
- Patent number 7,196,800
- Issue date Mar 27, 2007
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Optical analysis of integrated circuits
- Patent number 7,019,511
- Issue date Mar 28, 2006
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
IC die analysis via back side lens
- Patent number 6,864,972
- Issue date Mar 8, 2005
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor die analysis via fiber optic communication
- Patent number 6,850,081
- Issue date Feb 1, 2005
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Substrate removal as a function of emitted photons at the back side...
- Patent number 6,806,166
- Issue date Oct 19, 2004
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having backside probe points for direct sig...
- Patent number 6,720,641
- Issue date Apr 13, 2004
- Advanced Micro Devices, Inc.
- Jeffrey David Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect detection in semiconductor devices
- Patent number 6,686,757
- Issue date Feb 3, 2004
- Advanced Micro Devices, Inc.
- Rosalinda M. Ring
- G01 - MEASURING TESTING
Information Patent Grant
SOI die analysis of circuitry logic states via coupling through the...
- Patent number 6,621,281
- Issue date Sep 16, 2003
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
IC die analysis via back side circuit construction with heat dissip...
- Patent number 6,576,484
- Issue date Jun 10, 2003
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic resonance imaging of semiconductor devices
- Patent number 6,529,029
- Issue date Mar 4, 2003
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Circuit construction in back side of die and over a buried insulator
- Patent number 6,518,783
- Issue date Feb 11, 2003
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Test fixture for future integration
- Patent number 6,500,699
- Issue date Dec 31, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Quadrant avalanche photodiode time-resolved detection
- Patent number 6,483,327
- Issue date Nov 19, 2002
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Nanomachining of integrated circuits
- Patent number 6,472,760
- Issue date Oct 29, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe grid for integrated circuit analysis
- Patent number 6,455,334
- Issue date Sep 24, 2002
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Atomic force microscopy and signal acquisition via buried insulator
- Patent number 6,448,096
- Issue date Sep 10, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit access and analysis for a SOI flip-chip die
- Patent number 6,448,095
- Issue date Sep 10, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Intergrated circuit integrity analysis as a function of magnetic fi...
- Patent number 6,433,572
- Issue date Aug 13, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Acoustic 3D analysis of circuit structures
- Patent number 6,430,728
- Issue date Aug 6, 2002
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Selective back side wet etch
- Patent number 6,428,718
- Issue date Aug 6, 2002
- Advanced Micro Devices, Inc.
- Jeffrey Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Defect detection via acoustic analysis
- Patent number 6,421,811
- Issue date Jul 16, 2002
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for stress testing a semiconductor device usin...
- Patent number 6,417,680
- Issue date Jul 9, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device navigation using laser scribing
- Patent number 6,417,068
- Issue date Jul 9, 2002
- Advance Micro Devices, Inc.
- Victoria Bruce
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective state change analysis of a SOI die
- Patent number 6,414,335
- Issue date Jul 2, 2002
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Nanomachining method for integrated circuits
- Patent number 6,403,388
- Issue date Jun 11, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Selectively activatable solar cells for integrated circuit analysis
- Patent number 6,391,664
- Issue date May 21, 2002
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for circuit rebuilding via backside access
- Patent number 6,388,334
- Issue date May 14, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit defect detection via laser heat and IR thermography
- Patent number 6,387,715
- Issue date May 14, 2002
- Advanced Micro Devices, Inc.
- Brennan V. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Forming elongated probe points useful in testing semiconductor devices
- Patent number 6,372,529
- Issue date Apr 16, 2002
- Advanced Micro Devices, Inc.
- Rosalinda M. Ring
- G01 - MEASURING TESTING
Information Patent Grant
Selective back side reactive ion etch
- Patent number 6,355,564
- Issue date Mar 12, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SOI die analysis of circuitry logic states via coupling through the...
- Publication number 20020084792
- Publication date Jul 4, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING

Jeffrey David Birdsley

Person

Patents Grantslast 30 patents

Semiconductor die analysis as a function of optical reflections fro...

Optical analysis of integrated circuits

IC die analysis via back side lens

Semiconductor die analysis via fiber optic communication

Substrate removal as a function of emitted photons at the back side...

Semiconductor structure having backside probe points for direct sig...

Defect detection in semiconductor devices

SOI die analysis of circuitry logic states via coupling through the...

IC die analysis via back side circuit construction with heat dissip...

Magnetic resonance imaging of semiconductor devices

Circuit construction in back side of die and over a buried insulator

Test fixture for future integration

Quadrant avalanche photodiode time-resolved detection

Nanomachining of integrated circuits

Probe grid for integrated circuit analysis

Atomic force microscopy and signal acquisition via buried insulator

Circuit access and analysis for a SOI flip-chip die

Intergrated circuit integrity analysis as a function of magnetic fi...

Acoustic 3D analysis of circuit structures

Selective back side wet etch

Defect detection via acoustic analysis

Method and apparatus for stress testing a semiconductor device usin...

Semiconductor device navigation using laser scribing

Selective state change analysis of a SOI die

Nanomachining method for integrated circuits

Selectively activatable solar cells for integrated circuit analysis

System and method for circuit rebuilding via backside access

Integrated circuit defect detection via laser heat and IR thermography

Forming elongated probe points useful in testing semiconductor devices

Selective back side reactive ion etch

Patents Applicationslast 30 patents

SOI die analysis of circuitry logic states via coupling through the...