Jeffrey David Punzalan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,100,719
- Issue date Sep 24, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dams
- Patent number 11,881,494
- Issue date Jan 23, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages for sensor chips
- Patent number 11,670,521
- Issue date Jun 6, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with substrate and method of ma...
- Patent number 10,109,587
- Issue date Oct 23, 2018
- STATS ChipPAC Pte. Ltd.
- Dao Nguyen Phu Cuong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,659,897
- Issue date May 23, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a wafer level package wi...
- Patent number 9,589,876
- Issue date Mar 7, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with substrate and method of ma...
- Patent number 9,412,624
- Issue date Aug 9, 2016
- STATS ChipPAC Pte. Ltd.
- Dao Nguyen Phu Cuong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,355,983
- Issue date May 31, 2016
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with coreless substrate and met...
- Patent number 9,305,809
- Issue date Apr 5, 2016
- Stats Chippac Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump interconnection
- Patent number 9,129,971
- Issue date Sep 8, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with relief
- Patent number 8,981,548
- Issue date Mar 17, 2015
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with protective coating and met...
- Patent number 8,803,300
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including wide flange leadframe
- Patent number 8,698,294
- Issue date Apr 15, 2014
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with flex bump
- Patent number 8,637,394
- Issue date Jan 28, 2014
- Stats Chippac Ltd.
- Jairus Legaspi Pisigan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with laminate base
- Patent number 8,633,578
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with integral inner lead and padd...
- Patent number 8,633,062
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Padless die support integrated circuit package system
- Patent number 8,629,537
- Issue date Jan 14, 2014
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a wafer level package wi...
- Patent number 8,546,189
- Issue date Oct 1, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging system with hollow package and method for the same
- Patent number 8,493,748
- Issue date Jul 23, 2013
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-leaded integrated circuit package system with multiple ground s...
- Patent number 8,415,778
- Issue date Apr 9, 2013
- Stats Chippac Ltd.
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-leaded integrated circuit package system
- Patent number 8,399,968
- Issue date Mar 19, 2013
- Stats Chippac Ltd.
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package to package stacking system
- Patent number 8,395,251
- Issue date Mar 12, 2013
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-on-lead package system having leadfingers positioned between p...
- Patent number 8,362,601
- Issue date Jan 29, 2013
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with leads separated from a die p...
- Patent number 8,278,148
- Issue date Oct 2, 2012
- Stats Chippac Ltd.
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with flashless leads
- Patent number 8,207,597
- Issue date Jun 26, 2012
- Stats Chippac Ltd.
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package in package system with adhesiveless pack...
- Patent number 8,203,214
- Issue date Jun 19, 2012
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with multiple device units and me...
- Patent number 8,203,220
- Issue date Jun 19, 2012
- Stats Chippac Ltd.
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with leadfinger
- Patent number 8,148,825
- Issue date Apr 3, 2012
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Optical Semiconductor...
- Publication number 20240339484
- Publication date Oct 10, 2024
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING FOR IMAGE SENSORS
- Publication number 20240186346
- Publication date Jun 6, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS
- Publication number 20230122384
- Publication date Apr 20, 2023
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS
- Publication number 20230098224
- Publication date Mar 30, 2023
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Optical Semiconductor...
- Publication number 20230036239
- Publication date Feb 2, 2023
- UTAC Headquarters Pte. Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Optical Semiconductor...
- Publication number 20220384505
- Publication date Dec 1, 2022
- UTAC Headquarters Pte. Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DAMS
- Publication number 20220093482
- Publication date Mar 24, 2022
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20220093664
- Publication date Mar 24, 2022
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210399035
- Publication date Dec 23, 2021
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210366963
- Publication date Nov 25, 2021
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210193483
- Publication date Jun 24, 2021
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Wafer Level Package wi...
- Publication number 20130341789
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE GROUND S...
- Publication number 20110298108
- Publication date Dec 8, 2011
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LAMINATE BASE
- Publication number 20110284842
- Publication date Nov 24, 2011
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM INCLUDING NON-LEADED PACKAGE
- Publication number 20110204501
- Publication date Aug 25, 2011
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Bump Interconnection
- Publication number 20110101524
- Publication date May 5, 2011
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PROTECTIVE COATING AND MET...
- Publication number 20110079888
- Publication date Apr 7, 2011
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADD...
- Publication number 20100264529
- Publication date Oct 21, 2010
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS AND ME...
- Publication number 20100244273
- Publication date Sep 30, 2010
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-ON-LEAD PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF
- Publication number 20100140764
- Publication date Jun 10, 2010
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR
- Publication number 20100140766
- Publication date Jun 10, 2010
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Wafer Level Package wi...
- Publication number 20100072599
- Publication date Mar 25, 2010
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Wafer Level Package wi...
- Publication number 20100072618
- Publication date Mar 25, 2010
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT SUPPORT
- Publication number 20090250798
- Publication date Oct 8, 2009
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER SUPPORT
- Publication number 20090179314
- Publication date Jul 16, 2009
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BASE STRUCTURE DEVICE
- Publication number 20090085178
- Publication date Apr 2, 2009
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME ARRAY
- Publication number 20090085177
- Publication date Apr 2, 2009
- Jairus Legaspi Pisigan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS
- Publication number 20090079096
- Publication date Mar 26, 2009
- Lionel Chien Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE ENCAPSULATION HAVING...
- Publication number 20090072412
- Publication date Mar 19, 2009
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey David Punzalan

Person

Patents Grantslast 30 patents

Reliable semiconductor packages

Reliable semiconductor packages

Reliable semiconductor packages

Semiconductor package with dams

Reliable semiconductor packages for sensor chips

Integrated circuit packaging system with substrate and method of ma...

Integrated circuit packaging system with interposer structure and m...

Semiconductor device and method of forming a wafer level package wi...

Integrated circuit packaging system with substrate and method of ma...

Integrated circuit packaging system with interposer structure and m...

Integrated circuit packaging system with coreless substrate and met...

Semiconductor device with bump interconnection

Integrated circuit package system with relief

Integrated circuit packaging system with protective coating and met...

Integrated circuit package system including wide flange leadframe

Integrated circuit package system with flex bump

Integrated circuit package system with laminate base

Integrated circuit package system with integral inner lead and padd...

Padless die support integrated circuit package system

Semiconductor device and method of forming a wafer level package wi...

Packaging system with hollow package and method for the same

Non-leaded integrated circuit package system with multiple ground s...

Non-leaded integrated circuit package system

Integrated circuit package to package stacking system

Wire-on-lead package system having leadfingers positioned between p...

Integrated circuit package system with leads separated from a die p...

Integrated circuit package system with flashless leads

Integrated circuit package in package system with adhesiveless pack...

Integrated circuit package system with multiple device units and me...

Integrated circuit package system with leadfinger

Patents Applicationslast 30 patents

RELIABLE SEMICONDUCTOR PACKAGES

Semiconductor Device and Method of Making an Optical Semiconductor...

SEMICONDUCTOR PACKAGING FOR IMAGE SENSORS

SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS

SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS

Semiconductor Device and Method of Making an Optical Semiconductor...

Semiconductor Device and Method of Forming an Optical Semiconductor...

SEMICONDUCTOR PACKAGE WITH DAMS

RELIABLE SEMICONDUCTOR PACKAGES

RELIABLE SEMICONDUCTOR PACKAGES

RELIABLE SEMICONDUCTOR PACKAGES

RELIABLE SEMICONDUCTOR PACKAGES

Semiconductor Device and Method of Forming a Wafer Level Package wi...

NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE GROUND S...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LAMINATE BASE

INTEGRATED CIRCUIT PACKAGING SYSTEM INCLUDING NON-LEADED PACKAGE

Semiconductor Device with Bump Interconnection

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PROTECTIVE COATING AND MET...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADD...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS AND ME...

WIRE-ON-LEAD PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF

LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR

Semiconductor Device and Method of Forming a Wafer Level Package wi...

Semiconductor Device and Method of Forming a Wafer Level Package wi...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT SUPPORT

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER SUPPORT

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BASE STRUCTURE DEVICE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME ARRAY

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE ENCAPSULATION HAVING...