Jeffrey EWANCHUK

Person

Manchester, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power converter
- Patent number 12,176,687
- Issue date Dec 24, 2024
- Hamilton Sundstrand Corporation
- Chi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact circuit devices using ceramic-copper layers based packaging
- Patent number 12,095,368
- Issue date Sep 17, 2024
- Hamilton Sundstrand Corporation
- Suman Dwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling in conductors for chips
- Patent number 12,063,763
- Issue date Aug 13, 2024
- Hamilton Sundstrand Corporation
- Jeffrey Ewanchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of dies electrically connected to a printed circuit board...
- Patent number 11,935,807
- Issue date Mar 19, 2024
- Hamilton Sundstrand Corporation
- Karthik Debbadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
AC-to-AC power supplies using multi-frequency power conversion buil...
- Patent number 11,532,993
- Issue date Dec 20, 2022
- B/E Aerospace, Inc.
- Suman Dwari
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multi-level single-phase AC-to-DC converter
- Patent number 11,424,692
- Issue date Aug 23, 2022
- Hamilton Sundstrand Corporation
- Suman Dwari
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED TRANSFORMER WITH 3D LOW PERMEABILITY INSERTS
- Publication number 20240355528
- Publication date Oct 24, 2024
- Raytheon Company
- Jeffrey Ewanchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Solid State Circuit Breaker Structure
- Publication number 20240291478
- Publication date Aug 29, 2024
- Jeffrey Ewanchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT BOARD ASSEMBLIES
- Publication number 20240251507
- Publication date Jul 25, 2024
- Simmonds Precision Products, Inc.
- Jeffrey Ewanchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE TURN OFF CONTROL GATE DRIVER FOR SOLID STATE CIRCUIT BREAKER
- Publication number 20240243567
- Publication date Jul 18, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Jeffrey Ewanchuk
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER CONVERTER
- Publication number 20230378724
- Publication date Nov 23, 2023
- HAMILTON SUNDSTRAND CORPORATION
- Chi Zhang
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
COOLING IN CONDUCTORS FOR CHIPS
- Publication number 20230077598
- Publication date Mar 16, 2023
- HAMILTON SUNDSTRAND CORPORATION
- Jeffrey Ewanchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT CIRCUIT DEVICES USING CERAMIC-COPPER LAYERS BASED PACKAGING
- Publication number 20220393590
- Publication date Dec 8, 2022
- HAMILTON SUNDSTRAND CORPORATION
- Suman Dwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE PACKAGING
- Publication number 20220199483
- Publication date Jun 23, 2022
- HAMILTON SUNDSTRAND CORPORATION
- Karthik DEBBADI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL SINGLE-PHASE AC-TO-DC CONVERTER
- Publication number 20220200473
- Publication date Jun 23, 2022
- HAMILTON SUNDSTRAND CORPORATION
- Suman Dwari
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Jeffrey EWANCHUK

Person

Patents Grantslast 30 patents

Power converter

Compact circuit devices using ceramic-copper layers based packaging

Cooling in conductors for chips

Plurality of dies electrically connected to a printed circuit board...

AC-to-AC power supplies using multi-frequency power conversion buil...

Multi-level single-phase AC-to-DC converter

Patents Applicationslast 30 patents

INTEGRATED TRANSFORMER WITH 3D LOW PERMEABILITY INSERTS

Enhanced Solid State Circuit Breaker Structure

ELECTRICAL CIRCUIT BOARD ASSEMBLIES

ACTIVE TURN OFF CONTROL GATE DRIVER FOR SOLID STATE CIRCUIT BREAKER

POWER CONVERTER

COOLING IN CONDUCTORS FOR CHIPS

COMPACT CIRCUIT DEVICES USING CERAMIC-COPPER LAYERS BASED PACKAGING

POWER DEVICE PACKAGING

MULTI-LEVEL SINGLE-PHASE AC-TO-DC CONVERTER