Jeffrey F. Bryant

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Amherst, NH, US

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Patents Grantslast 30 patents

Information Patent Grant
Stacked modular architecture high-resolution thermal chip camera
- Patent number 9,787,914
- Issue date Oct 10, 2017
- BAE Systems Information and Electronic Systems Integration Inc.
- Louise C Sengupta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
STACKED MODULAR ARCHITECTURE HIGH-RESOLUTION THERMAL CHIP CAMERA
- Publication number 20170070685
- Publication date Mar 9, 2017
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Louise C. Sengupta
- H01 - BASIC ELECTRIC ELEMENTS