Jeffrey J. Frye

Person

Grayslake, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure sensor with external vertical electrical interconnection s...
- Patent number 11,385,118
- Issue date Jul 12, 2022
- Vitesco Technologies USA, LLC.
- Jeffrey J. Frye
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sealing glass geometries for sensitivity enhancement of thick-film...
- Patent number 11,187,605
- Issue date Nov 30, 2021
- Vitesco Technologies USA, LLC.
- Zhijun Guo
- G01 - MEASURING TESTING
Information Patent Grant
Piezoresistive transducer with low thermal noise
- Patent number 9,395,259
- Issue date Jul 19, 2016
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,791,540
- Issue date Jul 29, 2014
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,791,539
- Issue date Jul 29, 2014
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin semiconductor die package
- Patent number 8,618,675
- Issue date Dec 31, 2013
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor for harsh media sensing and flexible packaging
- Patent number 8,215,176
- Issue date Jul 10, 2012
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- G01 - MEASURING TESTING
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,164,153
- Issue date Apr 24, 2012
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed microdevice with getter shield
- Patent number 7,204,737
- Issue date Apr 17, 2007
- Temic Automotive of North America, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Feedthrough design and method for a hermetically sealed microdevice
- Patent number 6,929,974
- Issue date Aug 16, 2005
- Motorola, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEALING GLASS GEOMETRIES FOR SENSITIVITY ENHANCEMENT OF THICK-FILM...
- Publication number 20210041317
- Publication date Feb 11, 2021
- Continental Powertrain USA, LLC
- Zhijun Guo
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR WITH EXTERNAL VERTICAL ELECTRICAL INTERCONNECTION S...
- Publication number 20200182728
- Publication date Jun 11, 2020
- Vitesco Technologies USA, LLC
- Jeffrey J. Frye
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIEZORESISTIVE TRANSDUCER WITH LOW THERMAL NOISE
- Publication number 20140137653
- Publication date May 22, 2014
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
THIN SEMICONDUCTOR DIE PACKAGE
- Publication number 20130105999
- Publication date May 2, 2013
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin Semiconductor Device Having Embedded Die Support and Methods o...
- Publication number 20120153409
- Publication date Jun 21, 2012
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin Semiconductor Device Having Embedded Die Support and Methods o...
- Publication number 20120149153
- Publication date Jun 14, 2012
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE SUPPORT AND METHODS O...
- Publication number 20100301431
- Publication date Dec 2, 2010
- TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
- XIAOYI DING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR FOR HARSH MEDIA SENSING AND FLEXIBLE PACKAGING
- Publication number 20100300207
- Publication date Dec 2, 2010
- TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
- XIAOYI DING
- G01 - MEASURING TESTING
Information Patent Application
Hermetically sealed microdevice with getter sheild
- Publication number 20060063462
- Publication date Mar 23, 2006
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Feedthrough design and method for a hermetically sealed microdevice
- Publication number 20040077117
- Publication date Apr 22, 2004
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jeffrey J. Frye

Person

Patents Grantslast 30 patents

Pressure sensor with external vertical electrical interconnection s...

Sealing glass geometries for sensitivity enhancement of thick-film...

Piezoresistive transducer with low thermal noise

Thin semiconductor device having embedded die support and methods o...

Thin semiconductor device having embedded die support and methods o...

Thin semiconductor die package

Pressure sensor for harsh media sensing and flexible packaging

Thin semiconductor device having embedded die support and methods o...

Hermetically sealed microdevice with getter shield

Feedthrough design and method for a hermetically sealed microdevice

Patents Applicationslast 30 patents

SEALING GLASS GEOMETRIES FOR SENSITIVITY ENHANCEMENT OF THICK-FILM...

PRESSURE SENSOR WITH EXTERNAL VERTICAL ELECTRICAL INTERCONNECTION S...

PIEZORESISTIVE TRANSDUCER WITH LOW THERMAL NOISE

THIN SEMICONDUCTOR DIE PACKAGE

Thin Semiconductor Device Having Embedded Die Support and Methods o...

Thin Semiconductor Device Having Embedded Die Support and Methods o...

THIN SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE SUPPORT AND METHODS O...

PRESSURE SENSOR FOR HARSH MEDIA SENSING AND FLEXIBLE PACKAGING

Hermetically sealed microdevice with getter sheild

Feedthrough design and method for a hermetically sealed microdevice