Jeffrey L. Deeney

Person

Ft. Collins, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for supporting a circuit component having sold...
- Patent number 7,434,309
- Issue date Oct 14, 2008
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin shroud
- Patent number 7,273,386
- Issue date Sep 25, 2007
- Hewlett-Packard Development Company, L.P.
- Richard E. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around cooling arrangement for printed circuit board
- Patent number 6,882,536
- Issue date Apr 19, 2005
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for supporting circuit component having solder...
- Patent number 6,813,162
- Issue date Nov 2, 2004
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support assembly for an integrated circuit package having solder co...
- Patent number 6,791,184
- Issue date Sep 14, 2004
- Hewlett-Packard Development Company, L.P.
- Jeffrey L Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for supporting a circuit component having sold...
- Patent number 6,710,264
- Issue date Mar 23, 2004
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for supporting a circuit component
- Patent number 6,600,661
- Issue date Jul 29, 2003
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array integrated circuit device module
- Patent number 6,549,418
- Issue date Apr 15, 2003
- Hewlett-Packard Development Company, L.P.
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of supporting circuit component having a solde...
- Patent number 6,541,710
- Issue date Apr 1, 2003
- Hewlett-Packard Company
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit device package including multiple stacked compon...
- Patent number 6,477,058
- Issue date Nov 5, 2002
- Hewlett-Packard Company
- Richard J Luebs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive thermal interface
- Patent number 5,783,862
- Issue date Jul 21, 1998
- Hewlett-Packard Co.
- Jeffrey L. Deeney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonded (TAB) circuit
- Patent number 5,521,425
- Issue date May 28, 1996
- Hewlett-Packard Company
- Jeffrey L. Deeney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Pin Shroud
- Publication number 20060025005
- Publication date Feb 2, 2006
- Richard E. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for supporting circuit component having solder column array...
- Publication number 20050017349
- Publication date Jan 27, 2005
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for supporting a circuit component having sold...
- Publication number 20040035606
- Publication date Feb 26, 2004
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Support assembly for an integrated circuit package having solder co...
- Publication number 20040017006
- Publication date Jan 29, 2004
- Jeffrey L. Deeney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wrap- around cooling arrangement for printed circuit board
- Publication number 20030202328
- Publication date Oct 30, 2003
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for supporting circuit component having solder...
- Publication number 20030095392
- Publication date May 22, 2003
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for supporting a circuit component having sold...
- Publication number 20030094306
- Publication date May 22, 2003
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAND GRID ARRAY INTEGRATED CIRCUIT DEVICE MODULE
- Publication number 20030058624
- Publication date Mar 27, 2003
- Jeffrey L. Deeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device die and package having improved heat dissipati...
- Publication number 20030020160
- Publication date Jan 30, 2003
- Jeffrey L. Deeney
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey L. Deeney

Person

Patents Grantslast 30 patents

Method and apparatus for supporting a circuit component having sold...

Pin shroud

Wrap-around cooling arrangement for printed circuit board

Method and apparatus for supporting circuit component having solder...

Support assembly for an integrated circuit package having solder co...

Method and apparatus for supporting a circuit component having sold...

Method and apparatus for supporting a circuit component

Land grid array integrated circuit device module

Method and apparatus of supporting circuit component having a solde...

Integrated circuit device package including multiple stacked compon...

Electrically conductive thermal interface

Tape automated bonded (TAB) circuit

Patents Applicationslast 30 patents

Pin Shroud

Method for supporting circuit component having solder column array...

Method and apparatus for supporting a circuit component having sold...

Support assembly for an integrated circuit package having solder co...

Wrap- around cooling arrangement for printed circuit board

Method and apparatus for supporting circuit component having solder...

Method and apparatus for supporting a circuit component having sold...

LAND GRID ARRAY INTEGRATED CIRCUIT DEVICE MODULE

Semiconductor device die and package having improved heat dissipati...