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Jeffrey Lien

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  • Taipei City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Chip Assembly Structure With Cover
    • Publication number 20070275574
    • Publication date Nov 29, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Jeffrey Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FINE-SIZED CHIP PACKAGE STRUCTURE
    • Publication number 20070132111
    • Publication date Jun 14, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUC...
    • Publication number 20070004093
    • Publication date Jan 4, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of forming precision leads on a chip-supporting leadframe
    • Publication number 20060051899
    • Publication date Mar 9, 2006
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip fixed structure
    • Publication number 20050224927
    • Publication date Oct 13, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packaging method for integrated circuits
    • Publication number 20050227414
    • Publication date Oct 13, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    High density lead arrangement package structure
    • Publication number 20050184365
    • Publication date Aug 25, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Miniaturized chip scale package structure
    • Publication number 20050179119
    • Publication date Aug 18, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Concealable chip leadframe unit structure
    • Publication number 20050156290
    • Publication date Jul 21, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor chip leadframe module
    • Publication number 20050156289
    • Publication date Jul 21, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Manufacturing method of a modularized leadframe
    • Publication number 20050125999
    • Publication date Jun 16, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit board having deposit holes
    • Publication number 20050121224
    • Publication date Jun 9, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Switching media for chip carrier device
    • Publication number 20050116325
    • Publication date Jun 2, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Assembly structure for hiding electronic components
    • Publication number 20050117314
    • Publication date Jun 2, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Chip package structure
    • Publication number 20050098872
    • Publication date May 12, 2005
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS