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Jeffrey Niew
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Burr Ridge, IL, US
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last 30 patents
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Patent Grant
Package with a CMOS die positioned underneath a MEMS die
Patent number
8,791,531
Issue date
Jul 29, 2014
Knowles Electronics, LLC
Peter V. Loeppert
H04 - ELECTRIC COMMUNICATION TECHNIQUE
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Patent Grant
Protection of an integrated circuit with voltage variable materials
Patent number
6,351,011
Issue date
Feb 26, 2002
Littlefuse, Inc.
Stephen J. Whitney
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Package With A CMOS Die Positioned Underneath A MEMS Die
Publication number
20120161259
Publication date
Jun 28, 2012
Peter V. Loeppert
H04 - ELECTRIC COMMUNICATION TECHNIQUE