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Jeffrey R. Marino
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Fishkill, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Interlevel dielectric layer and metal layer sealing
Patent number
7,214,608
Issue date
May 8, 2007
International Business Machines Corporation
Matthew S. Angyal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Means of seeding and metallizing polyimide
Patent number
7,033,648
Issue date
Apr 25, 2006
International Business Machines Corporations
Fuad E. Doany
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Structure and method for reducing thermo-mechanical stress in stack...
Patent number
6,831,363
Issue date
Dec 14, 2004
International Business Machines Corporation
Timothy J. Dalton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ti liner for copper interconnect with low-k dielectric
Patent number
6,661,097
Issue date
Dec 9, 2003
International Business Machines Corporation
Larry Clevenger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gate electrode structure for field emission devices and method of m...
Patent number
6,010,918
Issue date
Jan 4, 2000
FED Corporation
Jeffrey R. Marino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices having metallurgies containing copper-semiconduc...
Patent number
5,855,993
Issue date
Jan 5, 1999
International Business Machines Corporation
Michael John Brady
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Field emitter device with a current limiter structure
Patent number
5,828,163
Issue date
Oct 27, 1998
FED Corporation
Gary W. Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cobalt-tin alloys and their applications for devices, chip intercon...
Patent number
5,755,859
Issue date
May 26, 1998
International Business Machines Corporation
Vlasta A. Brusic
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Electronic devices having metallurgies containing copper-semiconduc...
Patent number
5,633,047
Issue date
May 27, 1997
International Business Machines Corporation
Michael J. Brady
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING
Publication number
20060024961
Publication date
Feb 2, 2006
Matthew S. Angyal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Sacrificial metal liner for copper
Publication number
20040152295
Publication date
Aug 5, 2004
International Business Machines Corporation
Edward C. Cooney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Sacrificial Metal Liner For Copper
Publication number
20040150103
Publication date
Aug 5, 2004
International Business Machines Corporation
Edward C. Cooney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and method for reducing thermo-mechanical stress in stack...
Publication number
20040113278
Publication date
Jun 17, 2004
International Business Machines Corporation
Timothy J. Dalton
H01 - BASIC ELECTRIC ELEMENTS