Jeffrey S. Braden

Person

Livermore, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Partitioning of electronic packages
- Patent number 8,148,808
- Issue date Apr 3, 2012
- LV Sensors, Inc.
- Jeffrey S. Braden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connectable metal package
- Patent number 6,300,673
- Issue date Oct 9, 2001
- Advanced Interconnect Technologies, Inc.
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array electronic package
- Patent number 6,262,477
- Issue date Jul 17, 2001
- Advanced Interconnect Technologies
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum alloys for electronic components
- Patent number 5,952,083
- Issue date Sep 14, 1999
- Advanced Technology Interconnect, Inc.
- Arvind Parthasarathi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal ball grid array package with improved thermal conductivity
- Patent number 5,629,835
- Issue date May 13, 1997
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded plastic semiconductor package including heat spreader
- Patent number 5,608,267
- Issue date Mar 4, 1997
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesively sealed metal electronic package incorporating a multi-ch...
- Patent number 5,504,372
- Issue date Apr 2, 1996
- Olin Corporation
- Jeffrey S. Braden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal electronic package with reduced seal width
- Patent number 5,399,805
- Issue date Mar 21, 1995
- Olin Corporation
- Derek E. Tyler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded plastic semiconductor package including an aluminum alloy he...
- Patent number 5,367,196
- Issue date Nov 22, 1994
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal electronic package with reduced seal width
- Patent number 5,324,888
- Issue date Jun 28, 1994
- Olin Corporation
- Derek E. Tyler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the manufacture of an interconnect circuit
- Patent number 5,234,536
- Issue date Aug 10, 1993
- Olin Corporation
- Arvind Parthasarathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier ring having first and second ring means with bonded surfaces
- Patent number 5,132,773
- Issue date Jul 21, 1992
- Olin Corporation
- Jeffrey S. Braden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for housing a tape-bonded electronic device and the package...
- Patent number 5,073,521
- Issue date Dec 17, 1991
- Olin Corporation
- Jeffrey S. Braden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal electronic package having improved resistance to electromagne...
- Patent number 5,043,534
- Issue date Aug 27, 1991
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer lead frames for integrated circuit packages
- Patent number 5,025,114
- Issue date Jun 18, 1991
- Olin Corporation
- Jeffrey S. Braden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Kit for the assembly of a metal electronic package
- Patent number 5,013,871
- Issue date May 7, 1991
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process plate for plastic pin grid array manufacturing
- Patent number 4,970,781
- Issue date Nov 20, 1990
- Olin Corporation
- Kin-Shiung Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Partitioning of electronic packages
- Publication number 20090045498
- Publication date Feb 19, 2009
- Jeffrey S. Braden
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey S. Braden

Person

Patents Grantslast 30 patents

Partitioning of electronic packages

Edge connectable metal package

Ball grid array electronic package

Aluminum alloys for electronic components

Metal ball grid array package with improved thermal conductivity

Molded plastic semiconductor package including heat spreader

Adhesively sealed metal electronic package incorporating a multi-ch...

Metal electronic package with reduced seal width

Molded plastic semiconductor package including an aluminum alloy he...

Metal electronic package with reduced seal width

Process for the manufacture of an interconnect circuit

Carrier ring having first and second ring means with bonded surfaces

Method for housing a tape-bonded electronic device and the package...

Metal electronic package having improved resistance to electromagne...

Multi-layer lead frames for integrated circuit packages

Kit for the assembly of a metal electronic package

Process plate for plastic pin grid array manufacturing

Patents Applicationslast 30 patents

Partitioning of electronic packages