JEFFREY S LEIB

Person

HILLSBORO, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication of gate-all-around integrated circuit structures having...
- Patent number 12,051,698
- Issue date Jul 30, 2024
- Intel Corporation
- Daniel G. Ouellette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 11,961,767
- Issue date Apr 16, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,664,439
- Issue date May 30, 2023
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 11,508,626
- Issue date Nov 22, 2022
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate structures for advanced integrated circuit structu...
- Patent number 11,482,611
- Issue date Oct 25, 2022
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differentiated voltage threshold metal gate structures for advanced...
- Patent number 11,342,445
- Issue date May 24, 2022
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,088,261
- Issue date Aug 10, 2021
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal chemical vapor deposition approaches for fabricating wrap-aro...
- Patent number 11,063,151
- Issue date Jul 13, 2021
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization in integrated circuit structures
- Patent number 11,018,222
- Issue date May 25, 2021
- Intel Corporation
- Daniel B. O'Brien
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 10,957,782
- Issue date Mar 23, 2021
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate structures for advanced integrated circuit structu...
- Patent number 10,886,383
- Issue date Jan 5, 2021
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structures for advanced integrated circuit structur...
- Patent number 10,854,732
- Issue date Dec 1, 2020
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 10,840,151
- Issue date Nov 17, 2020
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 10,796,968
- Issue date Oct 6, 2020
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate structures for advanced integrated circuit structu...
- Patent number 10,790,378
- Issue date Sep 29, 2020
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differentiated voltage threshold metal gate structures for advanced...
- Patent number 10,741,669
- Issue date Aug 11, 2020
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structures for advanced integrated circuit structur...
- Patent number 10,727,313
- Issue date Jul 28, 2020
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wrap-around contact on a semiconductor device
- Patent number 10,297,499
- Issue date May 21, 2019
- Intel Corporation
- Jeffrey S Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate structures for advanced integrated circuit structu...
- Patent number 10,121,875
- Issue date Nov 6, 2018
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct plasma densification process and semiconductor devices
- Patent number 10,096,513
- Issue date Oct 9, 2018
- Intel Corporation
- Jason A. Farmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct plasma densification process and semiconductor devices
- Patent number 9,711,399
- Issue date Jul 18, 2017
- Intel Corporation
- Jason A. Farmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wrap-around contact on a semiconductor device
- Patent number 9,704,744
- Issue date Jul 11, 2017
- Intel Corporation
- Jeffrey S Leib
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20240186403
- Publication date Jun 6, 2024
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20240178071
- Publication date May 30, 2024
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20240162332
- Publication date May 16, 2024
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20230261089
- Publication date Aug 17, 2023
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED AND SELF-ALIGNED BURIED POWER RAIL
- Publication number 20230207466
- Publication date Jun 29, 2023
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS
- Publication number 20230143021
- Publication date May 11, 2023
- Intel Corporation
- Daniel B. OBrien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20230042218
- Publication date Feb 9, 2023
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING...
- Publication number 20220093597
- Publication date Mar 24, 2022
- Intel Corporation
- Daniel G. OUELLETTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20210249524
- Publication date Aug 12, 2021
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...
- Publication number 20210091206
- Publication date Mar 25, 2021
- Intel Corporation
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20210043520
- Publication date Feb 11, 2021
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20210043754
- Publication date Feb 11, 2021
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...
- Publication number 20200388697
- Publication date Dec 10, 2020
- Intel Corporation
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED VOLTAGE THRESHOLD METAL GATE STRUCTURES FOR ADVANCED...
- Publication number 20200335603
- Publication date Oct 22, 2020
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20200321449
- Publication date Oct 8, 2020
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR ENHANCING INTERCONNECT RELI...
- Publication number 20200066645
- Publication date Feb 27, 2020
- Intel Corporation
- Jason A. FARMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20200027965
- Publication date Jan 23, 2020
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20200013680
- Publication date Jan 9, 2020
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CHEMICAL VAPOR DEPOSITION APPROACHES FOR FABRICATING WRAP-ARO...
- Publication number 20190393336
- Publication date Dec 26, 2019
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20190164846
- Publication date May 30, 2019
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...
- Publication number 20190165146
- Publication date May 30, 2019
- Intel Corporation
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED VOLTAGE THRESHOLD METAL GATE STRUCTURES FOR ADVANCED...
- Publication number 20190164968
- Publication date May 30, 2019
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20190164969
- Publication date May 30, 2019
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20190165136
- Publication date May 30, 2019
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A WRAP-AROUND CONTACT ON A SEMICONDUCTOR DEVICE
- Publication number 20170309516
- Publication date Oct 26, 2017
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT PLASMA DENSIFICATION PROCESS AND SEMICONDUCTOR DEVICES
- Publication number 20170278748
- Publication date Sep 28, 2017
- Intel Corporation
- JASON A. FARMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT PLASMA DENSIFICATION PROCESS AND SEMICONDUCTOR DEVICES
- Publication number 20160307797
- Publication date Oct 20, 2016
- Intel Corporation
- JASON A. FARMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A WRAP-AROUND CONTACT ON A SEMICONDUCTOR DEVICE
- Publication number 20160254186
- Publication date Sep 1, 2016
- JEFFREY S LEIB
- H01 - BASIC ELECTRIC ELEMENTS

JEFFREY S LEIB

Person

Patents Grantslast 30 patents

Fabrication of gate-all-around integrated circuit structures having...

Dual metal silicide structures for advanced integrated circuit stru...

Dual metal gate structure having portions of metal gate layers in c...

Trench contact structures for advanced integrated circuit structure...

Trench contact structures for advanced integrated circuit structure...

Dual metal silicide structures for advanced integrated circuit stru...

Replacement gate structures for advanced integrated circuit structu...

Differentiated voltage threshold metal gate structures for advanced...

Trench contact structures for advanced integrated circuit structure...

Metal chemical vapor deposition approaches for fabricating wrap-aro...

Metallization in integrated circuit structures

Trench contact structures for advanced integrated circuit structure...

Replacement gate structures for advanced integrated circuit structu...

Dual metal gate structures for advanced integrated circuit structur...

Dual metal silicide structures for advanced integrated circuit stru...

Dual metal silicide structures for advanced integrated circuit stru...

Replacement gate structures for advanced integrated circuit structu...

Differentiated voltage threshold metal gate structures for advanced...

Dual metal gate structures for advanced integrated circuit structur...

Method of forming a wrap-around contact on a semiconductor device

Replacement gate structures for advanced integrated circuit structu...

Direct plasma densification process and semiconductor devices

Direct plasma densification process and semiconductor devices

Method of forming a wrap-around contact on a semiconductor device

Patents Applicationslast 30 patents

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

RECESSED AND SELF-ALIGNED BURIED POWER RAIL

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING...

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

REPLACEMENT GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

REPLACEMENT GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...

DIFFERENTIATED VOLTAGE THRESHOLD METAL GATE STRUCTURES FOR ADVANCED...

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

MICROELECTRONIC DEVICES AND METHODS FOR ENHANCING INTERCONNECT RELI...

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

METAL CHEMICAL VAPOR DEPOSITION APPROACHES FOR FABRICATING WRAP-ARO...

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

REPLACEMENT GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...

DIFFERENTIATED VOLTAGE THRESHOLD METAL GATE STRUCTURES FOR ADVANCED...

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

METHOD OF FORMING A WRAP-AROUND CONTACT ON A SEMICONDUCTOR DEVICE

DIRECT PLASMA DENSIFICATION PROCESS AND SEMICONDUCTOR DEVICES

DIRECT PLASMA DENSIFICATION PROCESS AND SEMICONDUCTOR DEVICES

METHOD OF FORMING A WRAP-AROUND CONTACT ON A SEMICONDUCTOR DEVICE