Jeffrey Scott Erlbaum

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reconfigurable electronic substrate
- Patent number 9,603,574
- Issue date Mar 28, 2017
- General Electric Company
- James Wilson Rose
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Modular sensor assembly and methods of fabricating the same
- Patent number 7,451,651
- Issue date Nov 18, 2008
- General Electric Company
- Charles Gerard Woychik
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
RECONFIGURABLE ELECTRONIC SUBSTRATE
- Publication number 20160183365
- Publication date Jun 23, 2016
- GENERAL ELECTRIC COMPANY
- James Wilson Rose
- G01 - MEASURING TESTING
Information Patent Application
OVERSIZED BACK PANEL FOR PHOTOVOLTAIC DEVICES
- Publication number 20140216547
- Publication date Aug 7, 2014
- PRIMESTAR SOLAR, INC.
- Troy Alan Berens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT INSERT FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS...
- Publication number 20130153002
- Publication date Jun 20, 2013
- PRIMESTAR SOLAR, INC.
- Max William Reed
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ADHESIVE PLUG FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS...
- Publication number 20130153003
- Publication date Jun 20, 2013
- PRIMESTAR SOLAR, INC.
- Troy Alan Berens
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
JUNCTION BOX WITH A SUPPORT MEMBER FOR THIN FILM PHOTOVOLTAIC DEVIC...
- Publication number 20130153004
- Publication date Jun 20, 2013
- PRIMESTAR SOLAR, INC.
- Jeffrey Todd Knapp
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHODS OF SUPPORTING A TRANSPARENT SUBSTRATE OF A THIN FILM PHOTOV...
- Publication number 20130153029
- Publication date Jun 20, 2013
- PRIMESTAR SOLAR, INC.
- Bradley Crume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTERCONNECTION AND METHOD
- Publication number 20090256254
- Publication date Oct 15, 2009
- GENERAL ELECTRIC COMPANY
- William Edward Burdick, JR.
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPON...
- Publication number 20080318413
- Publication date Dec 25, 2008
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOVERABLE ELECTRONIC COMPONENT
- Publication number 20080318055
- Publication date Dec 25, 2008
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Modular sensor assembly and methods of fabricating the same
- Publication number 20080134793
- Publication date Jun 12, 2008
- General Electric Company
- Charles Gerard Woychik
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Jeffrey Scott Erlbaum

Person

Patents Grantslast 30 patents

Reconfigurable electronic substrate

Modular sensor assembly and methods of fabricating the same

Patents Applicationslast 30 patents

RECONFIGURABLE ELECTRONIC SUBSTRATE

OVERSIZED BACK PANEL FOR PHOTOVOLTAIC DEVICES

SUPPORT INSERT FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS...

ADHESIVE PLUG FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS...

JUNCTION BOX WITH A SUPPORT MEMBER FOR THIN FILM PHOTOVOLTAIC DEVIC...

METHODS OF SUPPORTING A TRANSPARENT SUBSTRATE OF A THIN FILM PHOTOV...

WAFER LEVEL INTERCONNECTION AND METHOD

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPON...

RECOVERABLE ELECTRONIC COMPONENT

Modular sensor assembly and methods of fabricating the same