Jeffrey T. Coffin

Person

Pleasant Valley, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reworkable underfills for ceramic MCM C4 protection
- Patent number 8,492,199
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a flip-chip package
- Patent number 8,037,594
- Issue date Oct 18, 2011
- International Business Machines Corporation
- Jeffrey T. Coffin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Optimized thermally conductive plate and attachment method for enha...
- Patent number 7,489,512
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized thermally conductive plate and attachment method for enha...
- Patent number 7,319,591
- Issue date Jan 15, 2008
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for semiconductor chip carriers
- Patent number 6,740,959
- Issue date May 25, 2004
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a carrier and a semiconductor device
- Patent number 6,584,684
- Issue date Jul 1, 2003
- International Business Machines
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capping structure for electronics package undergoing compressive so...
- Patent number 6,462,271
- Issue date Oct 8, 2002
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct attachment of a chip to a cooling member
- Patent number 6,413,353
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Frank Louis Pompeo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Module with metal-ion matrix induced dendrites for interconnection
- Patent number 6,218,629
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic CBGA/CCGA structure with thermal paste cooling
- Patent number 5,990,418
- Issue date Nov 23, 1999
- International Business Machines Corporation
- Kevin G. Bivona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates and process
- Patent number 5,881,945
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates
- Patent number 5,881,944
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of inhibiting corrosion in an electronic package
- Patent number 5,049,201
- Issue date Sep 17, 1991
- International Business Machines Corporation
- Shirley Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
- Publication number 20120021567
- Publication date Jan 26, 2012
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized Thermally Conductive Plate and Attachment Method for Enha...
- Publication number 20080303021
- Publication date Dec 11, 2008
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
- Publication number 20070290378
- Publication date Dec 20, 2007
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHA...
- Publication number 20070236890
- Publication date Oct 11, 2007
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHA...
- Publication number 20060268521
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI shielding for semiconductor chip carriers
- Publication number 20030025180
- Publication date Feb 6, 2003
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping structure for electronics package undergoing compressive so...
- Publication number 20020079117
- Publication date Jun 27, 2002
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIRECT ATTACHMENT OF A CHIP TO A COOLING MEMBER
- Publication number 20010040006
- Publication date Nov 15, 2001
- FRANK LOUIS POMPEO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for assembling a carrier and a semiconductor device
- Publication number 20010007288
- Publication date Jul 12, 2001
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey T. Coffin

Person

Patents Grantslast 30 patents

Reworkable underfills for ceramic MCM C4 protection

Method of forming a flip-chip package

Optimized thermally conductive plate and attachment method for enha...

Optimized thermally conductive plate and attachment method for enha...

EMI shielding for semiconductor chip carriers

Method for assembling a carrier and a semiconductor device

Capping structure for electronics package undergoing compressive so...

Method for direct attachment of a chip to a cooling member

Module with metal-ion matrix induced dendrites for interconnection

Hermetic CBGA/CCGA structure with thermal paste cooling

Multi-layer solder seal band for semiconductor substrates and process

Multi-layer solder seal band for semiconductor substrates

Method of inhibiting corrosion in an electronic package

Patents Applicationslast 30 patents

NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION

Optimized Thermally Conductive Plate and Attachment Method for Enha...

NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION

OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHA...

OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHA...

EMI shielding for semiconductor chip carriers

Capping structure for electronics package undergoing compressive so...

METHOD FOR DIRECT ATTACHMENT OF A CHIP TO A COOLING MEMBER

Method for assembling a carrier and a semiconductor device