Jeffrey Toh Tuck Fook

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Chip on board leadframe for semiconductor components having area array
- Patent number 7,459,778
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for ball grid array chip packages having improved testing an...
- Patent number 7,116,122
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating semiconductor component with chip on board l...
- Patent number 7,049,173
- Issue date May 23, 2006
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having chip on board leadframe
- Patent number 6,903,449
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for ball grid array chip packages having improved testing an...
- Patent number 6,847,220
- Issue date Jan 25, 2005
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Ball grid array chip packages having improved testing and stacking...
- Publication number 20030112614
- Publication date Jun 19, 2003
- Wuu Yean Tay
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...