Jeffrey Tuck Fook Toh

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
U-shape tape for BOC FBGA package to improve moldability
- Patent number 6,617,201
- Issue date Sep 9, 2003
- Micron Technology, Inc.
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating thin integrated circuit units
- Patent number 6,468,831
- Issue date Oct 22, 2002
- Texas Instruments Incorporated
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked double sided integrated circuit package
- Patent number 6,274,929
- Issue date Aug 14, 2001
- Texas Instruments Incorporated
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device testing and burn-in methodology
- Patent number 6,218,202
- Issue date Apr 17, 2001
- Texas Instruments Incorporated
- Chee Kiang Yew
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
U-shape tape for BOC FBGA package to improve moldability
- Publication number 20030025185
- Publication date Feb 6, 2003
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin integrated circuit unit
- Publication number 20020000648
- Publication date Jan 3, 2002
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS