Jeffrey W. Metz

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Round Rock, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a bond pad and method therefor
- Patent number 7,271,013
- Issue date Sep 18, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Lois E. Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bond pad and method therefor
- Patent number 6,844,631
- Issue date Jan 18, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Lois E. Yong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device having a bond pad and method therefor
- Publication number 20050098903
- Publication date May 12, 2005
- Loise E. Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a bond pad and method therefor
- Publication number 20030173667
- Publication date Sep 18, 2003
- Lois E. Yong
- H01 - BASIC ELECTRIC ELEMENTS