Jeffrey Watson

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package with embedded materials in a molded structure to...
- Patent number 9,349,613
- Issue date May 24, 2016
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded electronic package geometry to control warpage and die stress
- Patent number 9,269,872
- Issue date Feb 23, 2016
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control stiffener ring package and fabrication method
- Patent number 8,986,806
- Issue date Mar 24, 2015
- Amkor Technology, Inc.
- Bora Baloglu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling molding compound geometry around a semicondu...
- Patent number 8,912,051
- Issue date Dec 16, 2014
- Amkor Technology, Inc.
- Ahmer Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stencil and method for depositing material onto a substrate
- Patent number 7,588,965
- Issue date Sep 15, 2009
- Intel Corporation
- Jeffrey R. Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device carrier and manufacture tape
- Patent number 7,228,622
- Issue date Jun 12, 2007
- Intel Corporation
- Jeffrey Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stencil and method for depositing material onto a substrate
- Patent number 7,129,590
- Issue date Oct 31, 2006
- Intel Corporation
- Jeffrey R. Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device carrier and manufacturing tape
- Patent number 7,127,805
- Issue date Oct 31, 2006
- Intel Corporation
- Jeffrey Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for surface mounting a heatsink to a printed circuit board
- Patent number 5,779,134
- Issue date Jul 14, 1998
- Intel Corporation
- Jeff R. Watson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing heat from an integrated circuit package that...
- Patent number 5,617,294
- Issue date Apr 1, 1997
- Intel Corporation
- Jeff R. Watson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink design integrating interface material
- Patent number 5,168,926
- Issue date Dec 8, 1992
- Intel Corporation
- Jeff Watson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Molded Electronic Package Geometry To Control Warpage And Die Stress
- Publication number 20160172214
- Publication date Jun 16, 2016
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stencil and method for depositing material onto a substrate
- Publication number 20060249858
- Publication date Nov 9, 2006
- Jeffrey R. Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package carrier tape
- Publication number 20050016898
- Publication date Jan 27, 2005
- Jeffrey Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stencil and method for depositing material onto a substrate
- Publication number 20040229406
- Publication date Nov 18, 2004
- Jeffrey R. Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package carrier tape
- Publication number 20040093721
- Publication date May 20, 2004
- Jeffrey Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jeffrey Watson

Person

Patents Grantslast 30 patents

Electronic package with embedded materials in a molded structure to...

Molded electronic package geometry to control warpage and die stress

Warpage control stiffener ring package and fabrication method

Method for controlling molding compound geometry around a semicondu...

Stencil and method for depositing material onto a substrate

Electronic device carrier and manufacture tape

Stencil and method for depositing material onto a substrate

Electronic device carrier and manufacturing tape

Method for surface mounting a heatsink to a printed circuit board

Apparatus for removing heat from an integrated circuit package that...

Heat sink design integrating interface material

Patents Applicationslast 30 patents

Molded Electronic Package Geometry To Control Warpage And Die Stress

Stencil and method for depositing material onto a substrate

Electronic package carrier tape

Stencil and method for depositing material onto a substrate

Electronic package carrier tape