Jei-Ming Chen

Person

Taipei Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of determining process recipes and forming a semiconductor...
- Patent number 12,087,644
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Fin cutting process and structures formed thereby
- Patent number 11,990,375
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and using mask
- Patent number 11,887,851
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,854,798
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 11,842,922
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,482,411
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fin cutting process and structures formed thereby
- Patent number 11,380,593
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma oxide layer
- Patent number 11,101,366
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Iwen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,957,585
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Fin cutting process and structures formed thereby
- Patent number 10,777,466
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post UV cure for gapfill improvement
- Patent number 10,727,064
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post UV cure for gapfill improvement
- Patent number 10,332,746
- Issue date Jun 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing CMOS transistor
- Patent number 9,502,305
- Issue date Nov 22, 2016
- United Microelectronics Corp.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spatial semiconductor structure
- Patent number 9,362,358
- Issue date Jun 7, 2016
- United Microelectronics Corporation
- Hung-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication transistor with non-uniform stress layer with...
- Patent number 9,343,573
- Issue date May 17, 2016
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spatial semiconductor structure and method of fabricating the same
- Patent number 9,105,582
- Issue date Aug 11, 2015
- United Microelectronics Corporation
- Hung-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interlevel dielectric (ILD) layer
- Patent number 9,034,759
- Issue date May 19, 2015
- United Microelectronics Corp.
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor process
- Patent number 9,034,726
- Issue date May 19, 2015
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a FinFET structure
- Patent number 8,951,884
- Issue date Feb 10, 2015
- United Microelectronics Corp.
- Hung-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with non-uniform stress layer with stress concentrated r...
- Patent number 8,937,369
- Issue date Jan 20, 2015
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating dielectric layer and shallow trench isolation
- Patent number 8,927,388
- Issue date Jan 6, 2015
- United Microelectronics Corp.
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and process thereof
- Patent number 8,772,904
- Issue date Jul 8, 2014
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an isolation structure
- Patent number 8,709,901
- Issue date Apr 29, 2014
- United Microelectronics Corp.
- Chia-Lung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained-silicon transistor and method of making the same
- Patent number 8,692,332
- Issue date Apr 8, 2014
- United Microelectronics Corp.
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lower metal layer thickness in PMOS region
- Patent number 8,674,452
- Issue date Mar 18, 2014
- United Microelectronics Corp.
- Chin-Cheng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide semiconductor transistor and method of manufacturing th...
- Patent number 8,580,625
- Issue date Nov 12, 2013
- Tsuo-Wen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for metal gate using ion implantation
- Patent number 8,536,038
- Issue date Sep 17, 2013
- United Microelectronics Corp.
- Shao-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and fabricating method thereof
- Patent number 7,514,347
- Issue date Apr 7, 2009
- United Microelectronics Corp.
- Feng-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating interconnect structure
- Patent number 7,439,154
- Issue date Oct 21, 2008
- United Microelectronics Corp.
- Feng-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascence process utilizing teos-based silicon oxide cap laye...
- Patent number 7,378,343
- Issue date May 27, 2008
- United Microelectronics Corp.
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20240387189
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING PROCESS RECIPES AND FORMING A SEMICONDUCTOR...
- Publication number 20240363452
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Cutting Process and Structures Formed Thereby
- Publication number 20240282638
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AND USING MASK
- Publication number 20240136184
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240112905
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERCONNECT STRUCTURE
- Publication number 20240071815
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERCONNECT STRUCTURE
- Publication number 20230050514
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AND USING MASK
- Publication number 20230032703
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220367179
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Determining Process Recipes and Forming a Semiconductor...
- Publication number 20220367293
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Cutting Process and Structures Formed Thereby
- Publication number 20220328360
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20220319862
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210407794
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Cutting Process and Structures Formed Thereby
- Publication number 20200411386
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20200135551
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Wen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remote Plasma Oxide Layer
- Publication number 20200044043
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Iwen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post UV Cure for Gapfill Improvement
- Publication number 20190318932
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CUTTING PROCESS AND STRUCTURES FORMED THEREBY
- Publication number 20190164844
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPATIAL SEMICONDUCTOR STRUCTURE
- Publication number 20150311284
- Publication date Oct 29, 2015
- UNITED MICROELECTRONICS CORPORATION
- Hung-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTER-LEVEL DIELECTRIC LAYER
- Publication number 20150206803
- Publication date Jul 23, 2015
- UNITED MICROELECTRONICS CORP.
- Wei-Hsin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A FINFET STRUCTURE
- Publication number 20150132966
- Publication date May 14, 2015
- UNITED MICROELECTRONICS CORP.
- Hung-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATION TRANSISTOR WITH NON-UNIFORM STRESS LAYER WITH...
- Publication number 20150087126
- Publication date Mar 26, 2015
- UNITED MICROELECTRONICS CORP.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPATIAL SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20150048486
- Publication date Feb 19, 2015
- UNITED MICROELECTRONICS CORPORATION
- Hung-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESS
- Publication number 20140256115
- Publication date Sep 11, 2014
- UNITED MICROELECTRONICS CORP.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ISOLATION STRUCTURE
- Publication number 20140213034
- Publication date Jul 31, 2014
- UNITED MICROELECTRONICS CORP.
- Chia-Lung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERLEVEL DIELECTRIC (ILD) LAYER
- Publication number 20140199836
- Publication date Jul 17, 2014
- UNITED MICROELECTRONICS CORP.
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DIELECTRIC LAYER AND SHALLOW TRENCH ISOLATION
- Publication number 20140134824
- Publication date May 15, 2014
- UNITED MICROELECTRONICS CORP.
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR
- Publication number 20140091395
- Publication date Apr 3, 2014
- UNITED MICROELECTRONICS CORP.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOS TRANSISTOR AND PROCESS THEREOF
- Publication number 20140042501
- Publication date Feb 13, 2014
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR TRANSISTOR
- Publication number 20140035070
- Publication date Feb 6, 2014
- UNITED MICROELECTRONICS CORPORATION
- Tsuo-Wen Lu
- H01 - BASIC ELECTRIC ELEMENTS

Jei-Ming Chen

Person

Patents Grantslast 30 patents

Methods of determining process recipes and forming a semiconductor...

Semiconductor Fin cutting process and structures formed thereby

Method for forming and using mask

Semiconductor device and method

Method for forming interconnect structure

Semiconductor device and method

Semiconductor fin cutting process and structures formed thereby

Remote plasma oxide layer

Semiconductor device and method of forming the same

Semiconductor Fin cutting process and structures formed thereby

Post UV cure for gapfill improvement

Post UV cure for gapfill improvement

Method for manufacturing CMOS transistor

Spatial semiconductor structure

Method of fabrication transistor with non-uniform stress layer with...

Spatial semiconductor structure and method of fabricating the same

Method for forming interlevel dielectric (ILD) layer

Semiconductor process

Method for forming a FinFET structure

Transistor with non-uniform stress layer with stress concentrated r...

Method of fabricating dielectric layer and shallow trench isolation

Semiconductor structure and process thereof

Method of forming an isolation structure

Strained-silicon transistor and method of making the same

Semiconductor device with lower metal layer thickness in PMOS region

Metal oxide semiconductor transistor and method of manufacturing th...

Manufacturing method for metal gate using ion implantation

Interconnect structure and fabricating method thereof

Method of fabricating interconnect structure

Dual damascence process utilizing teos-based silicon oxide cap laye...

Patents Applicationslast 30 patents

METHOD FOR FORMING SEMICONDUCTOR DEVICE

METHODS OF DETERMINING PROCESS RECIPES AND FORMING A SEMICONDUCTOR...

Semiconductor Fin Cutting Process and Structures Formed Thereby

METHOD FOR FORMING AND USING MASK

Semiconductor Device and Method

METHOD FOR FORMING INTERCONNECT STRUCTURE

METHOD FOR FORMING INTERCONNECT STRUCTURE

METHOD FOR FORMING AND USING MASK

Semiconductor Device and Method

Methods of Determining Process Recipes and Forming a Semiconductor...

Semiconductor Fin Cutting Process and Structures Formed Thereby

METHOD FOR FORMING SEMICONDUCTOR DEVICE

Semiconductor Device and Method

Semiconductor Fin Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Remote Plasma Oxide Layer

Post UV Cure for Gapfill Improvement

SEMICONDUCTOR STRUCTURE CUTTING PROCESS AND STRUCTURES FORMED THEREBY

SPATIAL SEMICONDUCTOR STRUCTURE

METHOD OF FORMING INTER-LEVEL DIELECTRIC LAYER

METHOD FOR FORMING A FINFET STRUCTURE

METHOD OF FABRICATION TRANSISTOR WITH NON-UNIFORM STRESS LAYER WITH...

SPATIAL SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PROCESS

METHOD FOR FORMING ISOLATION STRUCTURE

METHOD FOR FORMING INTERLEVEL DIELECTRIC (ILD) LAYER

METHOD OF FABRICATING DIELECTRIC LAYER AND SHALLOW TRENCH ISOLATION

TRANSISTOR

MOS TRANSISTOR AND PROCESS THEREOF

METAL OXIDE SEMICONDUCTOR TRANSISTOR