Jen Chieh Kao

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Device package
- Patent number 12,119,312
- Issue date Oct 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 12,087,652
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 11,862,544
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package
- Patent number 11,705,412
- Issue date Jul 18, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,462,455
- Issue date Oct 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Shiu-Fang Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,410,899
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package
- Patent number 11,037,891
- Issue date Jun 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,991,656
- Issue date Apr 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,950,530
- Issue date Mar 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,580,713
- Issue date Mar 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including filling mold via
- Patent number 10,381,300
- Issue date Aug 13, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Chieh Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,332,849
- Issue date Jun 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,074,622
- Issue date Sep 11, 2018
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced package structure
- Patent number 8,059,422
- Issue date Nov 15, 2011
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flip chip package process
- Patent number 7,614,888
- Issue date Nov 10, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold and method of molding semiconductor devices
- Patent number 7,247,267
- Issue date Jul 24, 2007
- Advanced Semiconductor Engineering, Inc.
- Jen-Chieh Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical component package and packaging including an optical compon...
- Patent number 7,002,257
- Issue date Feb 21, 2006
- Advanced Semiconductor Engineering Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water-level package with bump ring
- Patent number 6,838,762
- Issue date Jan 4, 2005
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with a cavity and fabricating method thereof
- Patent number 6,822,324
- Issue date Nov 23, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microsystem package structure
- Patent number 6,809,852
- Issue date Oct 26, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer-level package and method for manufacturing the same
- Patent number 6,768,207
- Issue date Jul 27, 2004
- Advanced Semiconductor Engineering Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical integrated circuit element package and process for making t...
- Patent number 6,693,364
- Issue date Feb 17, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE PACKAGE
- Publication number 20250038136
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429115
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20240145357
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC WEARABLE DEVICE
- Publication number 20240126327
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE PACKAGE
- Publication number 20230361060
- Publication date Nov 9, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230026633
- Publication date Jan 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Shiu-Fang YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384289
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20220344246
- Publication date Oct 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20210305181
- Publication date Sep 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200402911
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200365499
- Publication date Nov 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200312733
- Publication date Oct 1, 2020
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200161200
- Publication date May 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20200098709
- Publication date Mar 26, 2020
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190393126
- Publication date Dec 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Shiu-Fang YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180374805
- Publication date Dec 27, 2018
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180226314
- Publication date Aug 9, 2018
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180226365
- Publication date Aug 9, 2018
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INCLUDING FILLING MOLD VIA
- Publication number 20180151485
- Publication date May 31, 2018
- Advanced Semiconductor Engineering, Inc.
- Jen-Chieh KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME
- Publication number 20100200974
- Publication date Aug 12, 2010
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE PROCESS
- Publication number 20090087947
- Publication date Apr 2, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS AND STRUCTURE OF A THERMALLY ENHANCED PACKAGE
- Publication number 20090075027
- Publication date Mar 19, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B32 - LAYERED PRODUCTS
Information Patent Application
MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLD...
- Publication number 20070052078
- Publication date Mar 8, 2007
- Jen-Chieh Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING PROCESS
- Publication number 20070004087
- Publication date Jan 4, 2007
- Jen-Chieh Kao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Substrate strip for a transparent package
- Publication number 20050285245
- Publication date Dec 29, 2005
- Advanced Semiconductor Engineering, Inc.
- Jen-Chieh Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
[MOLD AND METHOD OF MOLDING SEMICONDUCTOR DEVICES]
- Publication number 20050037104
- Publication date Feb 17, 2005
- Jen-Chieh Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MICROSYSTEM PACKAGE STRUCTURE
- Publication number 20040184133
- Publication date Sep 23, 2004
- Tao Su
- G02 - OPTICS
Information Patent Application
Optical component package and packaging method thereof
- Publication number 20040104488
- Publication date Jun 3, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INTEGRATED CIRCUIT ELEMENT PACKAGE AND PROCESS FOR MAKING T...
- Publication number 20030234452
- Publication date Dec 25, 2003
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level package with bump and method for manufacturing the same
- Publication number 20030214007
- Publication date Nov 20, 2003
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jen Chieh Kao

Person

Patents Grantslast 30 patents

Device package

Semiconductor package device and method of manufacturing the same

Electronic assembly

Device package

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Device package

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device package including filling mold via

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Thermally enhanced package structure

Flip chip package process

Mold and method of molding semiconductor devices

Optical component package and packaging including an optical compon...

Water-level package with bump ring

Wafer-level package with a cavity and fabricating method thereof

Microsystem package structure

Multichip wafer-level package and method for manufacturing the same

Optical integrated circuit element package and process for making t...

Patents Applicationslast 30 patents

DEVICE PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC ASSEMBLY

ELECTRONIC WEARABLE DEVICE

DEVICE PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DE...

DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

DEVICE PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE INCLUDING FILLING MOLD VIA

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

FLIP CHIP PACKAGE PROCESS

MANUFACTURING PROCESS AND STRUCTURE OF A THERMALLY ENHANCED PACKAGE

MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLD...

CHIP PACKAGING PROCESS

Substrate strip for a transparent package

[MOLD AND METHOD OF MOLDING SEMICONDUCTOR DEVICES]

MICROSYSTEM PACKAGE STRUCTURE

Optical component package and packaging method thereof

OPTICAL INTEGRATED CIRCUIT ELEMENT PACKAGE AND PROCESS FOR MAKING T...

Wafer-level package with bump and method for manufacturing the same