Jen-Hsin LEE

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Moldboard positioning assembly and use thereof
- Patent number 7,959,126
- Issue date Jun 14, 2011
- Jen-Hsin Lee
- E04 - BUILDING

Patents Applicationslast 30 patents

Information Patent Application
MOLDBOARD POSITIONING ASSEMBLY AND USE THEREOF
- Publication number 20080111052
- Publication date May 15, 2008
- Jen-Hsin LEE
- E04 - BUILDING