Jen-Huan Yu

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,064
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,862,577
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,830,781
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,830,746
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with porous conductive structure and manufacturin...
- Patent number 11,482,491
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 11,211,341
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,089
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Output pin expansion using shift register receiving data bit each s...
- Patent number 8,307,126
- Issue date Nov 6, 2012
- Askey Computer Corporation
- Yi-Chang Hsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board of communication product and manufacturing method the...
- Patent number 8,106,302
- Issue date Jan 31, 2012
- Askey Computer Corp.
- Kuo-Ching Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having isolation cover and assembling method thereof
- Patent number 7,999,195
- Issue date Aug 16, 2011
- Askey Computer Corp.
- Chung-Shao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly device
- Patent number 7,958,625
- Issue date Jun 14, 2011
- Askey Computer Corp.
- Chia-Hung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modulized antenna structure
- Patent number 7,561,111
- Issue date Jul 14, 2009
- Compal Electronics, Inc.
- Jen-Huan Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device reducing influence of system noise on sensitivity...
- Patent number 7,435,916
- Issue date Oct 14, 2008
- Compal Electronic, Inc.
- Jen-Huan Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wireless communication module for a portable electronic device
- Patent number 7,321,334
- Issue date Jan 22, 2008
- Compal Electronics, Inc.
- Jen-Huan Yu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371813
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOMBINANT ANTIBODIES, KITS COMPRISING THE SAME, AND USES THEREOF
- Publication number 20240117070
- Publication date Apr 11, 2024
- CLAIR CO., LTD.
- Jen-Chieh YU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105642
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088062
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386862
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335523
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282555
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230067313
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230014450
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367338
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20220216071
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220122926
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME
- Publication number 20210193589
- Publication date Jun 24, 2021
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20200176387
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139886
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System Of Updating Firmware And Method Thereof, And Method Of Creat...
- Publication number 20100169709
- Publication date Jul 1, 2010
- Askey Computer Corporation
- Yi-Tung Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Control Device Having Output Pin Expansion Function and Output Pin...
- Publication number 20100169697
- Publication date Jul 1, 2010
- Askey Computer Corporation
- Yi-Chang Hsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SYSTEM AND METHOD FOR PROTECTING DATA OF NETWORK USERS
- Publication number 20100100960
- Publication date Apr 22, 2010
- Chunghwa Telecom Co., Ltd.
- I-Fang Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ASSEMBLY DEVICE
- Publication number 20100095518
- Publication date Apr 22, 2010
- ASKEY COMPUTER CORP.
- Chia-Hung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD OF COMMUNICATION PRODUCT AND MANUFACTURING METHOD THE...
- Publication number 20100089619
- Publication date Apr 15, 2010
- ASKEY COMPUTER CORP.
- Kuo-Ching CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING ISOLATION COVER AND ASSEMBLING METHOD THEREOF
- Publication number 20100091471
- Publication date Apr 15, 2010
- ASKEY COMPUTER CORP.
- Chung-Shao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE REDUCING INFLUENCE OF SYSTEM NOISE ON SENSITIVITY...
- Publication number 20080078575
- Publication date Apr 3, 2008
- Compal Electronics, Inc.
- Jen-Huan Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Modulized antenna structure
- Publication number 20070285317
- Publication date Dec 13, 2007
- COMPAL ELECTRONICS, INC.
- Jen-Huan Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic device with dual antenna structures and their switching...
- Publication number 20070218853
- Publication date Sep 20, 2007
- COMPAL ELECTRONICS, INC.
- Jen-Huan Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Portable electronic device to detect wireless signals in a shutdown...
- Publication number 20070105540
- Publication date May 10, 2007
- Compal Electronics, Inc.
- Jen-Huan Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wireless communication module for a portable electronic device
- Publication number 20070103372
- Publication date May 10, 2007
- Compal Electronics, Inc.
- Jen-Huan Yu
- G06 - COMPUTING CALCULATING COUNTING

Jen-Huan Yu

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Package structure and method of forming the same

Package structure and manufacturing method thereof

Package structure and method of fabricating the same

Package structure and manufacturing method thereof

Semiconductor device and method of manufacture

Package structure with porous conductive structure and manufacturin...

Package structure and method of fabrcating the same

Integrated circuit package and method

Output pin expansion using shift register receiving data bit each s...

Circuit board of communication product and manufacturing method the...

Circuit board having isolation cover and assembling method thereof

Assembly device

Modulized antenna structure

Electronic device reducing influence of system noise on sensitivity...

Wireless communication module for a portable electronic device

Patents Applicationslast 30 patents

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

RECOMBINANT ANTIBODIES, KITS COMPRISING THE SAME, AND USES THEREOF

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME

Integrated Circuit Package and Method

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

System Of Updating Firmware And Method Thereof, And Method Of Creat...

Control Device Having Output Pin Expansion Function and Output Pin...

SYSTEM AND METHOD FOR PROTECTING DATA OF NETWORK USERS

ASSEMBLY DEVICE

CIRCUIT BOARD OF COMMUNICATION PRODUCT AND MANUFACTURING METHOD THE...

CIRCUIT BOARD HAVING ISOLATION COVER AND ASSEMBLING METHOD THEREOF

ELECTRONIC DEVICE REDUCING INFLUENCE OF SYSTEM NOISE ON SENSITIVITY...

Modulized antenna structure

Electronic device with dual antenna structures and their switching...

Portable electronic device to detect wireless signals in a shutdown...

Wireless communication module for a portable electronic device