Jen-I Huang

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Hsinchu County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure with landing pads and manufacturing...
- Patent number 11,437,336
- Issue date Sep 6, 2022
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package structure and fabricating method
- Patent number 9,887,148
- Issue date Feb 6, 2018
- Powertech Technology Inc.
- Jen-I Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING ASSEMBLY AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20230223311
- Publication date Jul 13, 2023
- Powertech Technology Inc.
- Kun-Yung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210343674
- Publication date Nov 4, 2021
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20170338128
- Publication date Nov 23, 2017
- Powertech Technology Inc.
- Jen-I Huang
- H01 - BASIC ELECTRIC ELEMENTS