Jen-I Kuo

Follow

Person

Chiayii, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Coupling device with electro-magnetic compensation
- Patent number 7,508,282
- Issue date Mar 24, 2009
- Chung Shan Institute of Science and Technology
- Jen-I Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a ceramic substrate with a thermal conductive...
- Patent number 7,222,419
- Issue date May 29, 2007
- Chung-Shan Institute of Science and Technology
- Gwo-Ji Horng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Coupling device with electro-magnetic compensation
- Publication number 20080111650
- Publication date May 15, 2008
- Jen-I Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating multi-layer ceramic substrate
- Publication number 20060032574
- Publication date Feb 16, 2006
- Jen-I Kuo
- B32 - LAYERED PRODUCTS
Information Patent Application
Lamination process of packaging substrate
- Publication number 20040108058
- Publication date Jun 10, 2004
- Jen-I Kuo
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of fabricating a ceramic substrate with a thermal conductive...
- Publication number 20040045656
- Publication date Mar 11, 2004
- Gwo-Ji Horng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating a ceramic substrate with a thermal conductive...
- Publication number 20030110629
- Publication date Jun 19, 2003
- Gwo-Ji Horng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR