Jen-Kuang Fang

Person

Kaoshiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,024,569
- Issue date Jun 1, 2021
- ADVANCED SEMICONDUCOR ENGINEERING, INC.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate panel structure and manufacturing process
- Patent number 10,818,636
- Issue date Oct 27, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,685,934
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,672,696
- Issue date Jun 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,636,745
- Issue date Apr 28, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device, semiconductor device, and method for manufacturing...
- Patent number 10,566,279
- Issue date Feb 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,269,672
- Issue date Apr 23, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,224,301
- Issue date Mar 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure including die and substrate electri...
- Patent number 9,748,196
- Issue date Aug 29, 2017
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging flip chip and method of forming pre-solders on...
- Patent number 7,726,544
- Issue date Jun 1, 2010
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip stack package and fabricating method thereof
- Patent number 7,635,610
- Issue date Dec 22, 2009
- Adavnaced Semiconductor Engineering Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for printed circuit board
- Patent number 7,384,566
- Issue date Jun 10, 2008
- Advanced Semiconductor Engineering Inc.
- Hung-Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bumps
- Patent number 7,375,020
- Issue date May 20, 2008
- Advanced Semiconductor Engineering, Inc.
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless assembly package
- Patent number 7,262,497
- Issue date Aug 28, 2007
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure
- Patent number 7,064,428
- Issue date Jun 20, 2006
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method for making the same
- Patent number 7,041,534
- Issue date May 9, 2006
- Advanced Semiconductor Engineering, Inc.
- Shin Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump manufacturing method
- Patent number 6,989,326
- Issue date Jan 24, 2006
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing electrical characteristics of bumps
- Patent number 6,972,583
- Issue date Dec 6, 2005
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- G01 - MEASURING TESTING
Information Patent Grant
Bump fabrication process
- Patent number 6,967,153
- Issue date Nov 22, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip module packaging device using flip-chip bonding technology
- Patent number 6,933,616
- Issue date Aug 23, 2005
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for preventing burnt fuse pad from further electrical con...
- Patent number 6,927,964
- Issue date Aug 9, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,924,557
- Issue date Aug 2, 2005
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps
- Patent number 6,916,732
- Issue date Jul 12, 2005
- Advanced Semiconductor Engineering, Inc.
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for testing electrical characteristics of chips
- Patent number 6,878,963
- Issue date Apr 12, 2005
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- G01 - MEASURING TESTING
Information Patent Grant
Method of modifying tin to lead ratio in tin-lead bump
- Patent number 6,877,653
- Issue date Apr 12, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bump
- Patent number 6,875,683
- Issue date Apr 5, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball fabricating process
- Patent number 6,861,346
- Issue date Mar 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating wafer bumps
- Patent number 6,846,719
- Issue date Jan 25, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package and method for forming the same
- Patent number 6,838,311
- Issue date Jan 4, 2005
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump manufacturing method
- Patent number 6,827,252
- Issue date Dec 7, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PANEL STRUCTURE AND MANUFACTURING PROCESS
- Publication number 20200075540
- Publication date Mar 5, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190348344
- Publication date Nov 14, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...
- Publication number 20190229054
- Publication date Jul 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20190157197
- Publication date May 23, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190096823
- Publication date Mar 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190067142
- Publication date Feb 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190051590
- Publication date Feb 14, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013289
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013284
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20160079157
- Publication date Mar 17, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACK PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20070166879
- Publication date Jul 19, 2007
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging flip chip and method of forming pre-solders on...
- Publication number 20060124703
- Publication date Jun 15, 2006
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit boards and methods for fabricating the same
- Publication number 20050282314
- Publication date Dec 22, 2005
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Kuang-Lin Lo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication method for printed circuit board
- Publication number 20050246892
- Publication date Nov 10, 2005
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Hung-Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20050161812
- Publication date Jul 28, 2005
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and method for manufacturing the same
- Publication number 20050087859
- Publication date Apr 28, 2005
- Advanced Semiconductor Engineering, Inc.
- Shin Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BUMPS
- Publication number 20050085061
- Publication date Apr 21, 2005
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multi-chip stacking package
- Publication number 20050001303
- Publication date Jan 6, 2005
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumpless assembly package
- Publication number 20040226743
- Publication date Nov 18, 2004
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[METHOD OF FORMING BUMPS]
- Publication number 20040185651
- Publication date Sep 23, 2004
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[STRUCTURE FOR PREVENTING BURNT FUSE PAD FROM FURTHER ELECTRICAL CO...
- Publication number 20040114294
- Publication date Jun 17, 2004
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[SOLDER BALL FABRICATING PROCESS]
- Publication number 20040112944
- Publication date Jun 17, 2004
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip assembly and method for producing the same
- Publication number 20040080033
- Publication date Apr 29, 2004
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Jen Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP-METALLURGY LAYER
- Publication number 20030189261
- Publication date Oct 9, 2003
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND WIRE BONDING PROCESS SUITED FOR THE SAME
- Publication number 20030189249
- Publication date Oct 9, 2003
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip assembly and method for producing the same
- Publication number 20030189245
- Publication date Oct 9, 2003
- Advanced Semiconductor Engineering, Inc.
- Jen Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20030189260
- Publication date Oct 9, 2003
- HO-MING TONG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wafer level chip-scale package
- Publication number 20030168734
- Publication date Sep 11, 2003
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE FOR FABRICATING BUMP
- Publication number 20030164204
- Publication date Sep 4, 2003
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL ATTACHING PROCESS
- Publication number 20030164395
- Publication date Sep 4, 2003
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Jen-Kuang Fang

Person

Patents Grantslast 30 patents

Semiconductor package device and method of manufacturing the same

Substrate panel structure and manufacturing process

Semiconductor package device and method of manufacturing the same

Semiconductor device package

Semiconductor package device and method of manufacturing the same

Package device, semiconductor device, and method for manufacturing...

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package structure including die and substrate electri...

Method of packaging flip chip and method of forming pre-solders on...

Multi-chip stack package and fabricating method thereof

Fabrication method for printed circuit board

Method of forming bumps

Bumpless assembly package

Wafer-level package structure

Semiconductor chip package and method for making the same

Bump manufacturing method

Method for testing electrical characteristics of bumps

Bump fabrication process

Multi-chip module packaging device using flip-chip bonding technology

Structure for preventing burnt fuse pad from further electrical con...

Semiconductor package

Method of forming bumps

Device for testing electrical characteristics of chips

Method of modifying tin to lead ratio in tin-lead bump

Method of forming bump

Solder ball fabricating process

Process for fabricating wafer bumps

Flip chip package and method for forming the same

Bump manufacturing method

Patents Applicationslast 30 patents

SUBSTRATE PANEL STRUCTURE AND MANUFACTURING PROCESS

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

MULTI-CHIP STACK PACKAGE AND FABRICATING METHOD THEREOF

Method of packaging flip chip and method of forming pre-solders on...

Printed circuit boards and methods for fabricating the same

Fabrication method for printed circuit board

WAFER-LEVEL PACKAGE STRUCTURE

Semiconductor chip package and method for manufacturing the same

METHOD OF FORMING BUMPS

Method of manufacturing multi-chip stacking package

Bumpless assembly package

[METHOD OF FORMING BUMPS]

[STRUCTURE FOR PREVENTING BURNT FUSE PAD FROM FURTHER ELECTRICAL CO...

[SOLDER BALL FABRICATING PROCESS]

Flip chip assembly and method for producing the same

UNDER-BUMP-METALLURGY LAYER

CHIP STRUCTURE AND WIRE BONDING PROCESS SUITED FOR THE SAME

Flip chip assembly and method for producing the same

FLIP-CHIP BONDING STRUCTURE AND METHOD THEREOF

Wafer level chip-scale package

SOLDER PASTE FOR FABRICATING BUMP

SOLDER BALL ATTACHING PROCESS