JENCHUN CHEN

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Patents Grantslast 30 patents

Information Patent Grant
3D stacked package structure and method of manufacturing the same
- Patent number 9,167,686
- Issue date Oct 20, 2015
- Universal Scientific Industrial (Shanghai) Co., Ltd.
- Jenchun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 8,742,573
- Issue date Jun 3, 2014
- Universal Scientific Industrial (Shanghai) Co., Ltd.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140104799
- Publication date Apr 17, 2014
- UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
- JENCHUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140084483
- Publication date Mar 27, 2014
- UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
- JENCHUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS