Jeng-Huey Hwang

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for patterning HfO2-containing dielectric
- Patent number 7,186,657
- Issue date Mar 6, 2007
- United Microelectronics Corp.
- Jeng-Huey Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding-option architecture for integrated circuitry
- Patent number 6,034,539
- Issue date Mar 7, 2000
- Davicom Semiconductor, Inc.
- Jeng-Yan Hwang
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PATTERNING HFO2-CONTAINING DIELECTRIC
- Publication number 20070117304
- Publication date May 24, 2007
- Jeng-Huey Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PATTERNING HFO2-CONTAINING DIELECTRIC
- Publication number 20060019451
- Publication date Jan 26, 2006
- Jeng-Huey Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PATTERNING HFO2-CONTAINING DIELECTRIC
- Publication number 20060019452
- Publication date Jan 26, 2006
- Jeng-Huey Hwang
- H01 - BASIC ELECTRIC ELEMENTS