Jeng Je Pan

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Device casing with detachable bracket
- Patent number 11,064,629
- Issue date Jul 13, 2021
- Inventec (Pudong) Technology Corp.
- Yuan-Chang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chassis
- Patent number 10,555,433
- Issue date Feb 4, 2020
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chih-Wei Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer case
- Patent number 10,345,872
- Issue date Jul 9, 2019
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Shih-Wei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surface passivation for germanium-based semiconductor structure
- Patent number 9,647,090
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for reducing wafer edge tungsten residue utilizin...
- Patent number 6,881,675
- Issue date Apr 19, 2005
- Taiwan Semiconductor Manufacturing Co, Ltd.
- Jeng-Yang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of high selectivity wet etching of salicides
- Patent number 6,875,705
- Issue date Apr 5, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Jie Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic locking and releasing structure for push-pull plug
- Patent number 6,835,903
- Issue date Dec 28, 2004
- Ahoku Electronic Company
- Ke-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer tray positioning
- Patent number 6,794,615
- Issue date Sep 21, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jeng-Yang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for eliminating wafer breakage during wafer tr...
- Patent number 6,530,103
- Issue date Mar 11, 2003
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Yang Pan
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE CASING WITH DETACHABLE BRACKET
- Publication number 20210076528
- Publication date Mar 11, 2021
- Inventec (Pudong) Technology Corp.
- Yuan-Chang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE PASSIVATION FOR GERMANIUM-BASED SEMICONDUCTOR STRUCTURE
- Publication number 20160190286
- Publication date Jun 30, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL ADAPTER
- Publication number 20090081895
- Publication date Mar 26, 2009
- Anthony Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for reducing wafer edge tungsten residue utilizin...
- Publication number 20060205217
- Publication date Sep 14, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-Yang Pan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Safety plug allowing unplugging with one hand
- Publication number 20060030188
- Publication date Feb 9, 2006
- Ahoku Electronic Company
- Jeng Je Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of high selectivity wet etching of salicides
- Publication number 20040043624
- Publication date Mar 4, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Jie Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for reducing wafer edge tungsten residue utilizin...
- Publication number 20030216046
- Publication date Nov 20, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-Yang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer tray positioning
- Publication number 20030107125
- Publication date Jun 12, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-Yang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELIMINATING WAFER BREAKAGE DURING WAFER TR...
- Publication number 20020194689
- Publication date Dec 26, 2002
- Taiwan Semiconductor Manufacturing Co.,Ltd.
- Jeng-Yang Pan
- B08 - CLEANING

Jeng Je Pan

Person

Patents Grantslast 30 patents

Device casing with detachable bracket

Chassis

Computer case

Surface passivation for germanium-based semiconductor structure

Method and system for reducing wafer edge tungsten residue utilizin...

Method of high selectivity wet etching of salicides

Automatic locking and releasing structure for push-pull plug

Semiconductor wafer tray positioning

Method and apparatus for eliminating wafer breakage during wafer tr...

Patents Applicationslast 30 patents

DEVICE CASING WITH DETACHABLE BRACKET

SURFACE PASSIVATION FOR GERMANIUM-BASED SEMICONDUCTOR STRUCTURE

UNIVERSAL ADAPTER

Method and system for reducing wafer edge tungsten residue utilizin...

Safety plug allowing unplugging with one hand

Method of high selectivity wet etching of salicides

Method and system for reducing wafer edge tungsten residue utilizin...

Semiconductor wafer tray positioning

METHOD AND APPARATUS FOR ELIMINATING WAFER BREAKAGE DURING WAFER TR...