Jeng-Jen LI

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,636,735
- Issue date Apr 28, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,373,894
- Issue date Aug 6, 2019
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,373,930
- Issue date Aug 6, 2019
- Cyntec Co., Ltd.
- Jeng-Jen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 9,536,798
- Issue date Jan 3, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system with a composite substrate
- Patent number 9,484,290
- Issue date Nov 1, 2016
- CYNTEC Co, Ltd.
- Han-Hsiang Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Metal core printed circuit board and electronic package structure
- Patent number 9,386,686
- Issue date Jul 5, 2016
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package structure
- Patent number 8,619,428
- Issue date Dec 31, 2013
- Cyntec Co., Ltd.
- Han-Hsiang Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system with a composite substrate
- Patent number 8,547,709
- Issue date Oct 1, 2013
- Cyntec Co. Ltd.
- Han-Hsiang Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element packaging module
- Patent number 8,253,041
- Issue date Aug 28, 2012
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package structure
- Patent number 7,405,467
- Issue date Jul 29, 2008
- Cyntec Co., Ltd.
- Chun-Tiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method for organic polymer EL displays
- Patent number 6,383,048
- Issue date May 7, 2002
- Industrial Technology Research Institute
- Heng Long Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF
- Publication number 20170047273
- Publication date Feb 16, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF
- Publication number 20140042610
- Publication date Feb 13, 2014
- CYNTEC CO., LTD.
- JENG-JEN LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE
- Publication number 20130328181
- Publication date Dec 12, 2013
- Han-Hsiang Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF
- Publication number 20130213704
- Publication date Aug 22, 2013
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF
- Publication number 20130093069
- Publication date Apr 18, 2013
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE STRUCTURE
- Publication number 20120268896
- Publication date Oct 25, 2012
- Chi-Feng HUANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DRIVING CIRCUIT OF LIGHT EMITTING DIODES HAVING AT LEAST ONE BYPASS...
- Publication number 20120262074
- Publication date Oct 18, 2012
- Wei-Cheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20120075808
- Publication date Mar 29, 2012
- Han-Hsiang LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE
- Publication number 20110199746
- Publication date Aug 18, 2011
- CYNTEC CO. LTD.
- Han-Hsiang LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ELEMENT PACKAGING MODULE
- Publication number 20100309638
- Publication date Dec 9, 2010
- CYNTEC CO., LTD.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module package structure
- Publication number 20060267187
- Publication date Nov 30, 2006
- CYNTEC CO., LTD.
- Chun-Tiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure having mixed circuit and composite substrate
- Publication number 20060220188
- Publication date Oct 5, 2006
- CYNTEC CO., LTD.
- Chun-Tiao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Jeng-Jen LI

Person

Patents Grantslast 30 patents

Package structure and the method to fabricate thereof

Package structure and the method to fabricate thereof

Package structure and the method to fabricate thereof

Package structure and the method to fabricate thereof

Electronic system with a composite substrate

Metal core printed circuit board and electronic package structure

Electronic package structure

Electronic system with a composite substrate

Electronic element packaging module

Power module package structure

Packaging method for organic polymer EL displays

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

METAL CORE PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE STRUCTURE

DRIVING CIRCUIT OF LIGHT EMITTING DIODES HAVING AT LEAST ONE BYPASS...

ELECTRONIC PACKAGE STRUCTURE

ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE

ELECTRONIC ELEMENT PACKAGING MODULE

Power module package structure

Package structure having mixed circuit and composite substrate