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JENG-NAN HUNG

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  • TAICHUNG CITY, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20240404962
    • Publication date Dec 5, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Pei-Hsuan LO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER BONDING APPARATUS AND METHOD
    • Publication number 20240371705
    • Publication date Nov 7, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jeng-Nan HUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
    • Publication number 20240145316
    • Publication date May 2, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung-Jung WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240087986
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE
    • Publication number 20240047404
    • Publication date Feb 8, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package and Method
    • Publication number 20240038718
    • Publication date Feb 1, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jeng-Nan Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230170280
    • Publication date Jun 1, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE
    • Publication number 20220302068
    • Publication date Sep 22, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20220262703
    • Publication date Aug 18, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220238408
    • Publication date Jul 28, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210407887
    • Publication date Dec 30, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE
    • Publication number 20210217728
    • Publication date Jul 15, 2021
    • Taiwan Semiconductor Manufacturing company Ltd.
    • JENG-NAN HUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE
    • Publication number 20210159201
    • Publication date May 27, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210159139
    • Publication date May 27, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20210098335
    • Publication date Apr 1, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20200176357
    • Publication date Jun 4, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE
    • Publication number 20190363066
    • Publication date Nov 28, 2019
    • Taiwan Semiconductor Manufacturing company Ltd.
    • JENG-NAN HUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20180151538
    • Publication date May 31, 2018
    • Taiwan Semiconductor Manufacturing company Ltd.
    • JENG-NAN HUNG
    • H01 - BASIC ELECTRIC ELEMENTS