JENG-RU CHANG

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HSINCHU COUNTY 303, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package structure for achieving flip-chip type e...
- Patent number 8,748,209
- Issue date Jun 10, 2014
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package structure for achieving flip-chip type e...
- Patent number 8,053,904
- Issue date Nov 8, 2011
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FLIP-CHIP TYPE E...
- Publication number 20110229991
- Publication date Sep 22, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FLIP-CHIP TYPE E...
- Publication number 20110018019
- Publication date Jan 27, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNE...
- Publication number 20110018018
- Publication date Jan 27, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNE...
- Publication number 20090206465
- Publication date Aug 20, 2009
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS