Jeng-Shien Hsieh

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method
- Patent number 12,125,798
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,057,407
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device
- Patent number 12,040,566
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising rigid-flexible substrate...
- Patent number 12,040,281
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding low-k materials in antennas
- Patent number 11,984,668
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,830,841
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming thereof
- Patent number 11,562,926
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device and method for manufacturing antenna device
- Patent number 11,482,788
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer implemented food safety related management method
- Patent number 11,445,738
- Issue date Sep 20, 2022
- Sheng-Chih Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical semiconductor package and method for manufacturing the same
- Patent number 11,322,470
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising rigid-flexible substrate...
- Patent number 11,094,634
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package including voltage regulators and methods...
- Patent number 11,063,016
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulating low-k dielectric blocks along with dies in an encapsu...
- Patent number 11,050,153
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 10,996,410
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- G02 - OPTICS
Information Patent Grant
3D antenna for integrated circuits
- Patent number 10,978,781
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Shien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device and method for manufacturing antenna device
- Patent number 10,770,795
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with inductor and method of forming thereof
- Patent number 10,763,164
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor package and method for manufacturing the same
- Patent number 10,665,560
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D antenna for integrated circuits
- Patent number 10,498,009
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Shien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package including voltage regulators and methods...
- Patent number 10,497,668
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor packages
- Patent number 10,481,351
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- G02 - OPTICS
Information Patent Grant
Semiconductor device including integrated fan out antenna and metho...
- Patent number 10,297,925
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding low-k materials in antennas
- Patent number 10,270,172
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor package
- Patent number 10,162,139
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- G02 - OPTICS
Information Patent Grant
Integrated fan-out package including voltage regulators and methods...
- Patent number 10,163,852
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antennas and waveguides in InFO structures
- Patent number 10,153,239
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor for semiconductor integrated circuit
- Patent number 10,090,243
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,893,042
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan out antenna and method of forming the same
- Patent number 9,843,106
- Issue date Dec 12, 2017
- TAIWAN SEMICONDCUTOR MANUFACTURING COMPANY, LTD.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package including voltage regulators and methods...
- Patent number 9,831,148
- Issue date Nov 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240404900
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240355755
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20240332807
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...
- Publication number 20240321757
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS
- Publication number 20240206193
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK STRUCTURE WITH CONDUCTIVE PLUG AND METHOD FOR FORMING TH...
- Publication number 20240203918
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079392
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS
- Publication number 20240047365
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
- Publication number 20230420437
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20230378080
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOMECHANICAL TESTING SYSTEM AND REACTOR MODULE THEREOF
- Publication number 20230311117
- Publication date Oct 5, 2023
- Sheng-Chih CHANG
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
REACTOR MODULE AND BIOMECHANICAL TESTING SYSTEM HAVING THE SAME
- Publication number 20230295548
- Publication date Sep 21, 2023
- Sheng-Chih CHANG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ANTENNA DEVICE
- Publication number 20220384958
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20220352082
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220254747
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...
- Publication number 20210375770
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Low-K Materials in Antennas
- Publication number 20210328347
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER IMPLEMENTED FOOD SAFETY RELATED MANAGEMENT METHOD
- Publication number 20210068430
- Publication date Mar 11, 2021
- Sheng-Chih CHANG
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
ANTENNA DEVICE AND METHOD FOR MANUFACTURING ANTENNA DEVICE
- Publication number 20200411996
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20200402847
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200286845
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200203280
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20200088960
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- G02 - OPTICS
Information Patent Application
Integrated Fan-Out Package Including Voltage Regulators and Methods...
- Publication number 20200043891
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Antenna for Integrated Circuits
- Publication number 20200028240
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Low-K Materials in Antennas
- Publication number 20190252783
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGES
- Publication number 20190146166
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- G02 - OPTICS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190131267
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package Including Voltage Regulators and Methods...
- Publication number 20190123020
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20180138126
- Publication date May 17, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Jeng-Shien Hsieh

Person

Patents Grantslast 30 patents

Semiconductor package and method

Semiconductor package and method

Antenna device

Semiconductor package structure comprising rigid-flexible substrate...

Method of embedding low-k materials in antennas

Semiconductor package and method for manufacturing the same

Package structure and method of forming thereof

Antenna device and method for manufacturing antenna device

Computer implemented food safety related management method

Optical semiconductor package and method for manufacturing the same

Semiconductor package structure comprising rigid-flexible substrate...

Integrated fan-out package including voltage regulators and methods...

Encapsulating low-k dielectric blocks along with dies in an encapsu...

Methods of forming semiconductor packages

3D antenna for integrated circuits

Antenna device and method for manufacturing antenna device

Package structure with inductor and method of forming thereof

Optical semiconductor package and method for manufacturing the same

3D antenna for integrated circuits

Integrated fan-out package including voltage regulators and methods...

Semicondcutor packages

Semiconductor device including integrated fan out antenna and metho...

Embedding low-k materials in antennas

Semicondcutor package

Integrated fan-out package including voltage regulators and methods...

Antennas and waveguides in InFO structures

Inductor for semiconductor integrated circuit

Semiconductor device and method

Integrated fan out antenna and method of forming the same

Integrated fan-out package including voltage regulators and methods...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

Semiconductor Package and Method

ANTENNA DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS

CHIP STACK STRUCTURE WITH CONDUCTIVE PLUG AND METHOD FOR FORMING TH...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

Semiconductor Package and Method

BIOMECHANICAL TESTING SYSTEM AND REACTOR MODULE THEREOF

REACTOR MODULE AND BIOMECHANICAL TESTING SYSTEM HAVING THE SAME

ANTENNA DEVICE

Semiconductor Package and Method

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...

Embedding Low-K Materials in Antennas

COMPUTER IMPLEMENTED FOOD SAFETY RELATED MANAGEMENT METHOD

ANTENNA DEVICE AND METHOD FOR MANUFACTURING ANTENNA DEVICE

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING SEMICONDUCTOR PACKAGES

Integrated Fan-Out Package Including Voltage Regulators and Methods...

3D Antenna for Integrated Circuits

Embedding Low-K Materials in Antennas

SEMICONDCUTOR PACKAGES

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Integrated Fan-Out Package Including Voltage Regulators and Methods...

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF