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Tainan City, TW
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Patents Grants
last 30 patents
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Patent Grant
Double-axis soft hinge mechanism and foldable device having same
Patent number
12,135,589
Issue date
Nov 5, 2024
Google LLC
Shih-Wei Hsiang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Slurry composition, semiconductor structure and method for forming...
Patent number
12,131,944
Issue date
Oct 29, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Wei Hsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Pad structure for front side illuminated image sensor
Patent number
11,996,433
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanisms for forming image-sensor device with deep-trench isolati...
Patent number
11,973,101
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuits with redistribution lines
Patent number
11,923,338
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure for stacked device
Patent number
11,915,977
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked substrate structure with inter-tier interconnection
Patent number
11,817,470
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside illuminated global shutter image sensor
Patent number
11,769,781
Issue date
Sep 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Storage device and storage device management method
Patent number
11,733,911
Issue date
Aug 22, 2023
Compal Electronics, Inc.
Hsiu-En Hsu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Wafer bonding method and wafer bonding apparatus
Patent number
11,721,662
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yun-Tai Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolation structure for bond pad structure
Patent number
11,694,979
Issue date
Jul 4, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Sin-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bevel edge removal methods, tools, and systems
Patent number
11,664,213
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Chi Huang
B08 - CLEANING
Information
Patent Grant
Interconnect structure and method of forming same
Patent number
11,596,800
Issue date
Mar 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanisms for forming image-sensor device with deep-trench isolati...
Patent number
11,342,374
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad structure for front side illuminated image sensor
Patent number
11,322,540
Issue date
May 3, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure with back-side layer to reduce leakage
Patent number
11,244,925
Issue date
Feb 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Min-Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad structure for front side illuminated image sensor
Patent number
11,222,915
Issue date
Jan 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor including dual isolation and method of making the same
Patent number
11,152,414
Issue date
Oct 19, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked substrate structure with inter-tier interconnection
Patent number
11,043,522
Issue date
Jun 22, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside illuminated global shutter image sensor
Patent number
11,018,177
Issue date
May 25, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for 3D image sensor
Patent number
11,011,567
Issue date
May 18, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Min-Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolation structure for bond pad structure
Patent number
10,991,667
Issue date
Apr 27, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Sin-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertically integrated image sensor chips and methods for forming th...
Patent number
10,991,752
Issue date
Apr 27, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure for stacked device
Patent number
10,978,345
Issue date
Apr 13, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor device and method of forming same
Patent number
10,879,297
Issue date
Dec 29, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Wen-De Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding alignment tool
Patent number
10,847,490
Issue date
Nov 24, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Yun-Tai Shih
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Pad structure for front side illuminated image sensor
Patent number
10,833,119
Issue date
Nov 10, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Kai-Chun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Computer device and data protection method therefor
Patent number
10,824,561
Issue date
Nov 3, 2020
Compal Electronics, Inc.
Hsiu-En Hsu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device structure with back-side layer to reduce leakage
Patent number
10,790,265
Issue date
Sep 29, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Min-Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect apparatus and method for a stacked semiconductor device
Patent number
10,763,292
Issue date
Sep 1, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
Publication number
20240420978
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Chi LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING TOOL AND METHOD
Publication number
20240395537
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-hsiang Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLURRY COMPOSITION, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING...
Publication number
20240379421
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHUN-WEI HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
Publication number
20240363447
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Te-Chien HOU
B24 - GRINDING POLISHING
Information
Patent Application
ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
Publication number
20240290740
Publication date
Aug 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Sin-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
Publication number
20240170457
Publication date
May 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dynamic Configuration of an Oscillator Using Adaptive Voltage and C...
Publication number
20240146316
Publication date
May 2, 2024
MEDIATEK INC.
Yu-Shu Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
STACKED SUBSTRATE STRUCTURE WITH INTER-TIER INTERCONNECTION
Publication number
20240021645
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Novel CMP Pad Design and Method of Using the Same
Publication number
20230364734
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Pin-Chuan Su
B24 - GRINDING POLISHING
Information
Patent Application
IN-SITU DEFECT COUNT DETECTION IN POST CHEMICAL MECHANICAL POLISHING
Publication number
20230298949
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chun-Hung LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
Publication number
20230290749
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sin-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect Structure and Method of Forming Same
Publication number
20230201613
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
SLURRY COMPOSITION, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING...
Publication number
20230064918
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing company Ltd.
CHUN-WEI HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BEVEL EDGE REMOVAL METHODS, TOOLS, AND SYSTEMS
Publication number
20220359191
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Hui-Chi Huang
A46 - BRUSHWARE
Information
Patent Application
MECHANISMS FOR FORMING IMAGE-SENSOR DEVICE WITH DEEP-TRENCH ISOLATI...
Publication number
20220293644
Publication date
Sep 15, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Shyan LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
Publication number
20220254828
Publication date
Aug 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Chun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STORAGE DEVICE AND STORAGE DEVICE MANAGEMENT METHOD
Publication number
20220214828
Publication date
Jul 7, 2022
Compal Electronics, Inc.
Hsiu-En Hsu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
STACKED SUBSTRATE STRUCTURE WITH INTER-TIER INTERCONNECTION
Publication number
20210313376
Publication date
Oct 7, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE ILLUMINATED GLOBAL SHUTTER IMAGE SENSOR
Publication number
20210272989
Publication date
Sep 2, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
Publication number
20210242153
Publication date
Aug 5, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Sin-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect Structure for Stacked Device
Publication number
20210233813
Publication date
Jul 29, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BEVEL EDGE REMOVAL METHODS, TOOLS, AND SYSTEMS
Publication number
20210202239
Publication date
Jul 1, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Hui-Chi Huang
B08 - CLEANING
Information
Patent Application
Novel CMP Pad Design and Method of Using the Same
Publication number
20210053179
Publication date
Feb 25, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Pin-Chuan Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING METHOD AND WAFER BONDING APPARATUS
Publication number
20210050324
Publication date
Feb 18, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Yun-Tai SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
Publication number
20210043593
Publication date
Feb 11, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Sin-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
Publication number
20210028219
Publication date
Jan 28, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Kai-Chun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
Publication number
20200402954
Publication date
Dec 24, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Min-Feng KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE ILLUMINATED GLOBAL SHUTTER IMAGE SENSOR
Publication number
20200381465
Publication date
Dec 3, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect Structure and Method of Forming Same
Publication number
20200306552
Publication date
Oct 1, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
MECHANISMS FOR FORMING IMAGE-SENSOR DEVICE WITH DEEP-TRENCH ISOLATI...
Publication number
20200303429
Publication date
Sep 24, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Jeng-Shyan LIN
H01 - BASIC ELECTRIC ELEMENTS