JENG-SIAN WU

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Taoyuan City, TW

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH EMBEDDED TRACES
- Publication number 20240387350
- Publication date Nov 21, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION
- Publication number 20240274484
- Publication date Aug 15, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDERABLE SIDEWALL
- Publication number 20230395465
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS