JENIFFER OTERO ASPURIA

Person

BAGUIO CITY, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing a wafer
- Patent number 10,615,075
- Issue date Apr 7, 2020
- Texas Instruments Incorporated
- Jerry Gomez Cayabyab
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Backgrind Tape Planarization Using Heated Press
- Publication number 20240312787
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jose Franco A. Alicante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH FILM DIE PAD ISOLATION FOR SEMICONDUCTOR DEVICES
- Publication number 20230386979
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-BASED SEMICONDUCTOR WAFER SINGULATION
- Publication number 20230245928
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jeniffer ASPURIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...
- Publication number 20230207390
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLASH RESISTANT LASER WAFER SINGULATION BY CRACK LENGTH CONTROL
- Publication number 20230170257
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yang Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DICING A WAFER
- Publication number 20190385911
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- JERRY GOMEZ CAYABYAB
- H01 - BASIC ELECTRIC ELEMENTS

JENIFFER OTERO ASPURIA

Person

Patents Grantslast 30 patents

Dicing a wafer

Patents Applicationslast 30 patents

Method of Backgrind Tape Planarization Using Heated Press

DIE ATTACH FILM DIE PAD ISOLATION FOR SEMICONDUCTOR DEVICES

TEMPERATURE-BASED SEMICONDUCTOR WAFER SINGULATION

METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...

SPLASH RESISTANT LASER WAFER SINGULATION BY CRACK LENGTH CONTROL

DICING A WAFER