Jenn-Shyh Yu

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Fengyuan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Dual-sided chip package without a die pad
- Patent number 6,437,447
- Issue date Aug 20, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS