JENN-YUE WANG

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a metal gapfill
- Patent number 11,355,391
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing material overhang in a feature of a substrate
- Patent number 11,162,170
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Alan A. Ritchie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to grow thin epitaxial films at low temperature
- Patent number 9,929,055
- Issue date Mar 27, 2018
- Applied Materials, Inc.
- Abhishek Dube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to grow thin epitaxial films at low temperature
- Patent number 9,530,638
- Issue date Dec 27, 2016
- Applied Materials, Inc.
- Abhishek Dube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom up plating by organic surface passivation and differential p...
- Patent number 8,293,647
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Jenn-Yue Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Oxidized barrier layer
- Patent number 7,659,204
- Issue date Feb 9, 2010
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
NANOCRYSTALLINE DIAMOND WITH AMORPHOUS INTERFACIAL LAYER
- Publication number 20240352621
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Sze Chieh Tan
- C30 - CRYSTAL GROWTH
Information Patent Application
LOW TEMPERATURE SELECTIVE ETCHING OF SILICON NITRIDE USING MICROWAV...
- Publication number 20230109912
- Publication date Apr 13, 2023
- Applied Materials, Inc.
- Thai Cheng Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL GAPFILL
- Publication number 20200303250
- Publication date Sep 24, 2020
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO GROW THIN EPITAXIAL FILMS AT LOW TEMPERATURE
- Publication number 20170178962
- Publication date Jun 22, 2017
- Applied Materials, Inc.
- Abhishek DUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO GROW THIN EPITAXIAL FILMS AT LOW TEMPERATURE
- Publication number 20160126093
- Publication date May 5, 2016
- Applied Materials, Inc.
- Abhishek DUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING MATERIAL OVERHANG IN A FEATURE OF A SUBSTRATE
- Publication number 20150221486
- Publication date Aug 6, 2015
- Applied Materials, Inc.
- ALAN A. RITCHIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOTTOM UP PLATING BY ORGANIC SURFACE PASSIVATION AND DIFFERENTIAL P...
- Publication number 20100130007
- Publication date May 27, 2010
- Applied Materials, Inc.
- JENN-YUE WANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR FORMING METAL INTERCONNECT STRUCTURE FOR THIN FILM TRAN...
- Publication number 20080254613
- Publication date Oct 16, 2008
- APPLIED MATERIALS, INC.
- Yanping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Oxidized Barrier Layer
- Publication number 20080237029
- Publication date Oct 2, 2008
- Applied Materials, Inc.
- Xianmin TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etch and sidewall selectivity in plasma sputtering
- Publication number 20070209925
- Publication date Sep 13, 2007
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated process for sputter deposition of a conductive barrier l...
- Publication number 20070059502
- Publication date Mar 15, 2007
- Applied Materials, Inc.
- Rongjun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Conductive barrier layer, especially an alloy of ruthenium and tant...
- Publication number 20060251872
- Publication date Nov 9, 2006
- Jenn Yue Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

JENN-YUE WANG

Person

Patents Grantslast 30 patents

Method for forming a metal gapfill

Methods for reducing material overhang in a feature of a substrate

Method to grow thin epitaxial films at low temperature

Method to grow thin epitaxial films at low temperature

Bottom up plating by organic surface passivation and differential p...

Oxidized barrier layer

Patents Applicationslast 30 patents

NANOCRYSTALLINE DIAMOND WITH AMORPHOUS INTERFACIAL LAYER

LOW TEMPERATURE SELECTIVE ETCHING OF SILICON NITRIDE USING MICROWAV...

METHOD FOR FORMING A METAL GAPFILL

METHOD TO GROW THIN EPITAXIAL FILMS AT LOW TEMPERATURE

METHOD TO GROW THIN EPITAXIAL FILMS AT LOW TEMPERATURE

METHODS FOR REDUCING MATERIAL OVERHANG IN A FEATURE OF A SUBSTRATE

BOTTOM UP PLATING BY ORGANIC SURFACE PASSIVATION AND DIFFERENTIAL P...

METHODS FOR FORMING METAL INTERCONNECT STRUCTURE FOR THIN FILM TRAN...

Oxidized Barrier Layer

Etch and sidewall selectivity in plasma sputtering

Integrated process for sputter deposition of a conductive barrier l...

Conductive barrier layer, especially an alloy of ruthenium and tant...