Jennie S. Hwang

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Moreland Hills, OH, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a lead-free solder composition
- Patent number 10,105,794
- Issue date Oct 23, 2018
- Antaya Technologies Corporation
- Jennie S. Hwang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Lead-free solder composition
- Patent number 9,975,207
- Issue date May 22, 2018
- Antaya Technologies Corporation
- Jennie S. Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder composition
- Patent number 8,771,592
- Issue date Jul 8, 2014
- Antaya Technologies Corp.
- Jennie S. Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solders
- Patent number 6,176,947
- Issue date Jan 23, 2001
- H-Technologies Group, Incorporated
- Jennie S. Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High strength lead-free solder materials
- Patent number 5,985,212
- Issue date Nov 16, 1999
- H-Technologies Group, Incorporated
- Jennie S. Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite solders
- Patent number 5,520,752
- Issue date May 28, 1996
- The United States of America as represented by the Secretary of the Army
- George K. Lucey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A LEAD-FREE SOLDER COMPOSITION
- Publication number 20180207753
- Publication date Jul 26, 2018
- Antaya Technologies Corporation
- Jennie S. Hwang
- B60 - VEHICLES IN GENERAL
Information Patent Application
LEAD-FREE SOLDER COMPOSITION
- Publication number 20170190004
- Publication date Jul 6, 2017
- Antaya Technologies Corporation
- Jennie S. Hwang
- B60 - VEHICLES IN GENERAL
Information Patent Application
LEAD-FREE SOLDER COMPOSITION
- Publication number 20140271343
- Publication date Sep 18, 2014
- Antaya Technologies Corp.
- Jennie S. Hwang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LEAD-FREE SOLDER COMPOSITION
- Publication number 20120222893
- Publication date Sep 6, 2012
- Antaya Technologies Corporation
- Jennie S. Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High temperature lead-free solder compositions
- Publication number 20040241039
- Publication date Dec 2, 2004
- H-Technologies Group
- Jennie S. Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder compositions
- Publication number 20020155024
- Publication date Oct 24, 2002
- H-Technologies Group, Inc.
- Jennie S. Hwang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...