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Jennifer Shih
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Corvallis, OR, US
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Patents Grants
last 30 patents
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Patent Grant
System and method for direct bonding of substrates
Patent number
7,741,157
Issue date
Jun 22, 2010
Hewlett-Packard Development Company, L.P.
Charles C Haluzak
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
System and method for direct-bonding of substrates
Patent number
7,417,307
Issue date
Aug 26, 2008
Hewlett-Packard Development Company, L.P.
Charles C Haluzak
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
System And Method For Direct Bonding Of Substrates
Publication number
20080280398
Publication date
Nov 13, 2008
Charles C. Haluzak
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
System and method for direct-bonding of substrates
Publication number
20070026559
Publication date
Feb 1, 2007
Hewlett-Packard Development Company, L.P.
Charles C. Haluzak
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Sealing openings in micro-electromechanical systems
Publication number
20050101045
Publication date
May 12, 2005
Jennifer Shih
B81 - MICRO-STRUCTURAL TECHNOLOGY