Jens Goerlich

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Bueren, DE

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Patents Grantslast 30 patents

Information Patent Grant
Device including a semiconductor chip and a carrier and fabrication...
- Patent number 8,637,379
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a circuit substrate assembly and a power ele...
- Patent number 8,298,867
- Issue date Oct 30, 2012
- Infineon Technologies AG
- Olaf Hohlfeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...
- Publication number 20110084369
- Publication date Apr 14, 2011
- INFINEON TECHNOLOGIES AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Circuit Substrate Assembly and a Power Ele...
- Publication number 20110053319
- Publication date Mar 3, 2011
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE INCLUDING A STABLE SOLDER JOINT
- Publication number 20100068552
- Publication date Mar 18, 2010
- INFINEON TECHNOLOGIES AG
- Jens Goerlich
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...