Jens Oetjen

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Ottenhofen/Herdweg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Multi-functional interconnect module and carrier with multi-functio...
- Patent number 10,168,391
- Issue date Jan 1, 2019
- Infineon Technologies AG
- Giuliano Angelo Babulano
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced solder pad
- Patent number 10,121,753
- Issue date Nov 6, 2018
- Infineon Technologies AG
- Jens Oetjen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power package with integrated magnetic field sensor
- Patent number 9,564,423
- Issue date Feb 7, 2017
- Infineon Technologies AG
- Liu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated magnetic field sensor
- Patent number 9,564,578
- Issue date Feb 7, 2017
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing a contact region of a semiconductor module
- Patent number 7,265,564
- Issue date Sep 4, 2007
- Infineon Technologies AG
- Ralf Otremba
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED SOLDER PAD
- Publication number 20180012854
- Publication date Jan 11, 2018
- INFINEON TECHNOLOGIES AG
- Jens Oetjen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Magnetic Field Sensor
- Publication number 20160380181
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- G01 - MEASURING TESTING
Information Patent Application
POWER PACKAGE WITH INTEGRATED MAGNETIC FIELD SENSOR
- Publication number 20160379966
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Liu Chen
- G01 - MEASURING TESTING
Information Patent Application
Multi-Functional Interconnect Module and Carrier with Multi-Functio...
- Publication number 20160377689
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Giuliano Angelo Babulano
- G01 - MEASURING TESTING
Information Patent Application
Method for testing a contact region of a semiconductor module
- Publication number 20060066336
- Publication date Mar 30, 2006
- Ralf Otremba
- G01 - MEASURING TESTING