Jens Paul

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Pillar structure for use in packaging integrated circuit products a...
- Patent number 8,957,524
- Issue date Feb 17, 2015
- GLOBALFOUNDRIES Inc.
- Dirk Breuer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for reducing stress in substrate-based chip packages
- Patent number 7,180,162
- Issue date Feb 20, 2007
- Infineon Technologies AG
- Jens Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component with a contact and method for forming a contac...
- Patent number 6,791,349
- Issue date Sep 14, 2004
- Infineon Technologies AG
- Detlef Nagel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NOVEL PILLAR STRUCTURE FOR USE IN PACKAGING INTEGRATED CIRCUIT PROD...
- Publication number 20140264890
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Dirk Breuer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for reducing stress in substrate-based chip packages
- Publication number 20050017354
- Publication date Jan 27, 2005
- Jens Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical component with a contact and method for forming a contac...
- Publication number 20030184333
- Publication date Oct 2, 2003
- Detlef Nagel
- H01 - BASIC ELECTRIC ELEMENTS