Jeong Don Kwon

Person

Daejeon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition for frequency, and prepreg, laminat...
- Patent number 10,590,272
- Issue date Mar 17, 2020
- Doosan Corporation
- Dong Hee Jung
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition for frequency, and prepreg, laminat...
- Patent number 10,584,239
- Issue date Mar 10, 2020
- Doosan Corporation
- Dong Hee Jung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Encapsulation structure for transparent flexible organic electronic...
- Patent number 10,529,951
- Issue date Jan 7, 2020
- Korea Advanced Institute of Science and Technology
- Kyung Cheol Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition having heat resistance and low diel...
- Patent number 9,957,389
- Issue date May 1, 2018
- Doosan Corporation
- Dong Hee Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi layer circuit board and manufacturing method of the same
- Patent number 8,802,997
- Issue date Aug 12, 2014
- Doosan Corporation
- Jeong Don Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG USING SAME, LAMINATED SHEE...
- Publication number 20190292364
- Publication date Sep 26, 2019
- Doosan Corporation
- Moo Hyun KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR FREQUENCY, AND PREPREG, LAMINAT...
- Publication number 20190284393
- Publication date Sep 19, 2019
- Doosan Corporation
- Dong Hee JUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
ENCAPSULATION STRUCTURE FOR TRANSPARENT FLEXIBLE ORGANIC ELECTRONIC...
- Publication number 20190058157
- Publication date Feb 21, 2019
- Korea Advanced Institute of Science and Technology
- Kyung Cheol CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR FREQUENCY, AND PREPREG, LAMINAT...
- Publication number 20170342264
- Publication date Nov 30, 2017
- Doosan Corporation
- Dong Hee JUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION HAVING HEAT RESISTANCE AND LOW DIEL...
- Publication number 20160297967
- Publication date Oct 13, 2016
- Doosan Corporation
- Dong Hee JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI LAYER CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110214907
- Publication date Sep 8, 2011
- Doosan Corporation
- Jeong Don Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jeong Don Kwon

Person

Patents Grantslast 30 patents

Thermosetting resin composition for frequency, and prepreg, laminat...

Thermosetting resin composition for frequency, and prepreg, laminat...

Encapsulation structure for transparent flexible organic electronic...

Thermosetting resin composition having heat resistance and low diel...

Multi layer circuit board and manufacturing method of the same

Patents Applicationslast 30 patents

THERMOSETTING RESIN COMPOSITION, PREPREG USING SAME, LAMINATED SHEE...

THERMOSETTING RESIN COMPOSITION FOR FREQUENCY, AND PREPREG, LAMINAT...

ENCAPSULATION STRUCTURE FOR TRANSPARENT FLEXIBLE ORGANIC ELECTRONIC...

THERMOSETTING RESIN COMPOSITION FOR FREQUENCY, AND PREPREG, LAMINAT...

THERMOSETTING RESIN COMPOSITION HAVING HEAT RESISTANCE AND LOW DIEL...

MULTI LAYER CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME