Jeonghan Kim

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JIANGSU, CN

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Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20240379701
- Publication date Nov 14, 2024
- STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
- Jeonghan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240363515
- Publication date Oct 31, 2024
- STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
- Jeonghan Kim
- H01 - BASIC ELECTRIC ELEMENTS