JEONGHUN CHO

Person

Goyang-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with heat radiation board
- Patent number 11,682,610
- Issue date Jun 20, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,931
- Issue date Jun 13, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically attaching a chip to a substrate
- Patent number 11,482,463
- Issue date Oct 25, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressurizing members for semiconductor package
- Patent number 11,362,021
- Issue date Jun 14, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink board for a semiconductor device
- Patent number 11,289,397
- Issue date Mar 29, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,270,969
- Issue date Mar 8, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink board, manufacturing method thereof, and semiconductor pa...
- Patent number 11,171,074
- Issue date Nov 9, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing-type semiconductor power device package
- Patent number 11,056,420
- Issue date Jul 6, 2021
- JMJ KOREA CO., LTD.
- Yunhwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having heat dissipating structure
- Patent number 10,438,873
- Issue date Oct 8, 2019
- JMJ KOREA CO., LTD.
- Yunhwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having heat dissipating structure
- Patent number 10,204,848
- Issue date Feb 12, 2019
- JMJ KOREA CO., LTD.
- Yunhwa Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220148998
- Publication date May 12, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURIZED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210280501
- Publication date Sep 9, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210249342
- Publication date Aug 12, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PA...
- Publication number 20210143076
- Publication date May 13, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PA...
- Publication number 20210118768
- Publication date Apr 22, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200395264
- Publication date Dec 17, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200388588
- Publication date Dec 10, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSING-TYPE SEMICONDUCTOR POWER DEVICE PACKAGE
- Publication number 20190259686
- Publication date Aug 22, 2019
- JMJ KOREA CO., LTD.
- Yunhwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE HAVING HEAT DISSIPATING STRUCTURE
- Publication number 20180233439
- Publication date Aug 16, 2018
- JMJ KOREA CO., LTD.
- YUNHWA CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE HAVING HEAT DISSIPATING STRUCTURE
- Publication number 20180040541
- Publication date Feb 8, 2018
- JMJ KOREA CO., LTD.
- YUNHWA CHOI
- H01 - BASIC ELECTRIC ELEMENTS

JEONGHUN CHO

Person

Patents Grantslast 30 patents

Semiconductor package with heat radiation board

Semiconductor package

Vertically attaching a chip to a substrate

Pressurizing members for semiconductor package

Heat sink board for a semiconductor device

Semiconductor package

Heat sink board, manufacturing method thereof, and semiconductor pa...

Pressing-type semiconductor power device package

Semiconductor chip package having heat dissipating structure

Semiconductor chip package having heat dissipating structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PRESSURIZED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HEAT SINK BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PA...

HEAT SINK BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PRESSING-TYPE SEMICONDUCTOR POWER DEVICE PACKAGE

SEMICONDUCTOR CHIP PACKAGE HAVING HEAT DISSIPATING STRUCTURE

SEMICONDUCTOR CHIP PACKAGE HAVING HEAT DISSIPATING STRUCTURE