JeongHyuk PARK

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Incheon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 12,211,771
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 11,658,171
- Issue date May 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 11,652,030
- Issue date May 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE AND RELATED METHODS
- Publication number 20250125227
- Publication date Apr 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER
- Publication number 20230253393
- Publication date Aug 10, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND RELATED METHODS
- Publication number 20230245953
- Publication date Aug 3, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND RELATED METHODS
- Publication number 20220208654
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER
- Publication number 20220199602
- Publication date Jun 23, 2022
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS